ZHCSKE4C october   2016  – december 2020 DS280MB810

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements – Serial Management Bus Interface
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Data Path Operation
      2. 8.3.2 AC-coupled Receiver Inputs
      3. 8.3.3 Signal Detect
      4. 8.3.4 2-Stage CTLE
      5. 8.3.5 Driver DC Gain Control
      6. 8.3.6 2x2 Cross-point Switch
      7. 8.3.7 Configurable SMBus Address
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Slave Mode Configuration
      2. 8.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 8.5 Programming
      1. 8.5.1 Transfer of Data with the SMBus Interface
    6. 8.6 Register Maps
      1. 8.6.1 Register Types: Global, Shared, and Channel
      2. 8.6.2 Global Registers: Channel Selection and ID Information
      3. 8.6.3 Shared Registers
      4. 8.6.4 Channel Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Backplane and Mid-Plane Reach Extension
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Front-Port Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Pattern Generator Characteristics
        2. 9.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 9.2.3.3 Equalizing High Pre-Channel Loss
        4. 9.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
    3. 9.3 Initialization Set Up
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Stripline Example
      2. 11.2.2 Microstrip Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

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Detailed Design Procedure

The design procedure for front-port applications is as follows:

  1. Determine the total number of channels on the board which require a DS280MB810 for signal conditioning. This will dictate the total number of DS280MB810 devices required for the board. It is generally recommended that channels belonging to the same port be grouped together in the same DS280MB810 device. This will simplify the device settings, as similar loss channels generally utilize similar settings.
  2. Determine the maximum current draw required for all DS280MB810 devices. This may impact the selection of the regulator for the 2.5-V supply rail. To calculate the maximum current draw, multiply the maximum power supply current by the total number of DS280MB810 devices.
  3. Determine the SMBus address scheme needed to uniquely address each DS280MB810 device on the board, depending on the total number of devices identified in step 1. Each DS280MB810 can be strapped with one of 16 unique SMBus addresses. If there are more DS280MB810 devices on the board than the number of unique SMBus addresses which can be assigned, then use an I2C expander like the TCA/PCA family of I2C/SMBus switches and multiplexers to split the SMBus into multiple busses.
  4. Determine if the device will be configured from EEPROM (SMBus master mode) or from the system I2C bus (SMBus slave mode).
    1. If SMBus master mode will be used, provisions should be made for an EEPROM on the board with 8-bit SMBus address 0xA0. Refer to Section 8.4.2 for more details on SMBus Master Mode including EEPROM size requirements.
    2. If SMBus slave mode will be used for all device configurations, an EEPROM is not needed.
  5. Make provisions in the schematic and layout for standard decoupling capacitors between the device VDD supply and GND. Refer to Section 10 for more information.