ZHCSKE4C october   2016  – december 2020 DS280MB810

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements – Serial Management Bus Interface
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Data Path Operation
      2. 8.3.2 AC-coupled Receiver Inputs
      3. 8.3.3 Signal Detect
      4. 8.3.4 2-Stage CTLE
      5. 8.3.5 Driver DC Gain Control
      6. 8.3.6 2x2 Cross-point Switch
      7. 8.3.7 Configurable SMBus Address
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Slave Mode Configuration
      2. 8.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 8.5 Programming
      1. 8.5.1 Transfer of Data with the SMBus Interface
    6. 8.6 Register Maps
      1. 8.6.1 Register Types: Global, Shared, and Channel
      2. 8.6.2 Global Registers: Channel Selection and ID Information
      3. 8.6.3 Shared Registers
      4. 8.6.4 Channel Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Backplane and Mid-Plane Reach Extension
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Front-Port Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Pattern Generator Characteristics
        2. 9.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 9.2.3.3 Equalizing High Pre-Channel Loss
        4. 9.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
    3. 9.3 Initialization Set Up
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Stripline Example
      2. 11.2.2 Microstrip Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 支持高达 28Gbaud NRZ 接口的八通道多协议线性均衡器
  • 具有引脚或寄存器控制的集成 2x2 交叉点,适用于多路复用器、扇出和信号交叉应用
  • 低功耗:93mW/通道(典型值)
  • 无需散热器
  • 无缝支持链路协商、自动协商和前向纠错 (FEC) 直通功能的直线均衡
  • 频率为 14GHz 时,可将信道范围扩展 17dB+,超出常规 ASIC-to-ASIC 功能
  • 超低延迟:100ps(典型值)
  • 低附加随机抖动
  • 采用集成 RX 交流耦合电容的 8mm x 13mm BGA 小封装,适用于简易直通布线
  • 独特引脚可实现在封装下方布置高速信号布线
  • 提供交叉点的兼容引脚重定时器
  • 2.5V ±5% 单电源
  • 工作温度范围:–40°C 至 +85°C