SNLS375C June   1998  – January 2015 DS26C31T

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Device Logic Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 DC Electrical Characteristics
    4. 7.4 Switching Characteristics
    5. 7.5 Comparison Table of Switching Characteristics into “LS-Type” Load
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings(1)(2)(3)

MIN MAX UNIT
Supply Voltage (VCC) −0.5 7 V
DC Input Voltage (VIN) −1.5 VCC +1.5 V
DC Output Voltage (VOUT) −0.5 7 V
Clamp Diode Current (IIK, IOK) –20 20 mA
DC Output Current, per pin (IOUT) –150 150 mA
DC VCC or GND Current, per pin (ICC)
Max Power Dissipation (PD) at 25°C(4)           Ceramic “NFE” package 2419 mW
Plastic “NFG” package 1736 mW
SOIC “D” package 1226 mW
Ceramic “NAD” package 1182 mW
Ceramic “NAJ” package 2134 mW
Lead Temperature (TL)   (Soldering, 4 s) 260 °C
Storage Temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Unless otherwise specified, all voltages are referenced to ground. All currents into device pins are positive, all currents out of device pins are negative.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(4) Ratings apply to ambient temperature at 25°C. Above this temperature derate NFG package at 13.89 mW/°C, NFE package 16.13 mW/°C, D package 9.80 mW/°C, NAJ package 12.20 mW/°C, and NAD package 6.75 mW/°C.

7.2 Recommended Operating Conditions

MIN MAX UNIT
Supply Voltage (VCC) 4.50 5.50 V
DC Input or Output Voltage   (VIN, VOUT) 0 VCC V
Operating Temperature Range (TA)     DS26C31T −40 85 °C
DS26C31M −55 125 °C
Input Rise or Fall Times (tr, tf) 500 ns

7.3 DC Electrical Characteristics

VCC = 5 V ± 10% (unless otherwise specified)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH High Level Input Voltage 2.0 V
VIL Low Level Input Voltage 0.8 V
VOH High Level Output Voltage VIN = VIH or VIL, 2.5 3.4 V
IOUT = −20 mA
VOL Low Level Output Voltage VIN = VIH or VIL, 0.3 0.5 V
IOUT = 20 mA
VT Differential Output Voltage RL = 100 Ω 2.0 3.1 V
See(2)
|VT| − |VT | Difference In Differential Output RL = 100 Ω 0.4 V
See(2)
VOS Common Mode Output Voltage RL = 100 Ω 1.8 3.0 V
See(2)
|VOS − VOS | Difference In Common Mode Output RL = 100 Ω 0.4 V
See(2)
IIN Input Current VIN = VCC, GND, VIH, or VIL ±1.0 μA
ICC Quiescent Supply Current(3) DS26C31T VIN = VCC or GND 200 500 μA
IOUT = 0 μA VIN = 2.4 V or 0.5 V(3) 0.8 2.0 mA
DS26C31M VIN = VCC or GND 200 500 μA
IOUT = 0 μA VIN = 2.4 V or 0.5 V(3) 0.8 2.1 mA
IOZ TRI-STATE Output Leakage Current VOUT = VCC or GND
ENABLE = VIL ±0.5 ±5.0 μA
ENABLE = VIH
ISC Output Short Circuit Current VIN = VCC or GND(2)(4) −30 −150 mA
IOFF Output Leakage Current Power Off(2) DS26C31T VOUT = 6 V 100 μA
VCC = 0 V VOUT = −0.25 V −100 μA
DS26C31M VOUT = 6 V 100 μA
VCC = 0 V VOUT = 0 V(5) −100 μA
(1) Unless otherwise specified, min/max limits apply across the recommended operating temperature range. All typicals are given for VCC = 5 V and TA = 25°C.
(2) See EIA Specification RS-422 for exact test conditions.
(3) Measured per input. All other inputs at VCC or GND.
(4) This is the current sourced when a high output is shorted to ground. Only one output at a time should be shorted.
(5) The DS26C31M (−55°C to +125°C) is tested with VOUT between +6 V and 0 V while RS-422A condition is +6 V and −0.25 V.

7.4 Switching Characteristics

VCC = 5 V ±10%, tr ≤ 6 ns, tf ≤ 6 ns (Figure 22, Figure 23, Figure 24, Figure 25)(1)
PARAMETER TEST CONDITIONS MIN TYP DS26C31T DS26C31M UNIT
MAX MAX
tPLH, tPHL Propagation Delays Input to Output S1 Open 2 6 11 14 ns
Skew  (2) S1 Open 0.5 2.0 3.0 ns
tTLH, tTHL Differential Output Rise And Fall Times S1 Open 6 10 14 ns
tPZH Output Enable Time S1 Closed 11 19 22 ns
tPZL Output Enable Time S1 Closed 13 21 28 ns
tPHZ Output Disable Time(3) S1 Closed 5 9 12 ns
tPLZ Output Disable Time(3) S1 Closed 7 11 14 ns
CPD Power Dissipation Capacitance(4) 50 pF
CIN Input Capacitance 6 pF
(1) Unless otherwise specified, min/max limits apply across the recommended operating temperature range. All typicals are given for VCC = 5 V and TA = 25°C.
(2) Skew is defined as the difference in propagation delays between complementary outputs at the 50% point.
(3) Output disable time is the delay from ENABLE or ENABLE being switched to the output transistors turning off. The actual disable times are less than indicated due to the delay added by the RC time constant of the load.
(4) CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC.

7.5 Comparison Table of Switching Characteristics into “LS-Type” Load

VCC = 5 V, TA = 25°C, tr ≤ 6 ns, tf ≤ 6 ns (Figure 23, Figure 25, Figure 26, Figure 27) (1)
PARAMETER TEST CONDITIONS DS26C31T DS26LS31C UNIT
TYP MAX TYP MAX
tPLH, tPHL Propagation Delays Input to Output CL = 30 pF 6 8 10 15 ns
S1 Closed
S2 Closed
Skew See(2) CL = 30 pF 0.5 1.0 2.0 6.0 ns
S1 Closed
S2 Closed
tTHL, tTLH Differential Output Rise and Fall Times CL = 30 pF 4 6 ns
S1 Closed
S2 Closed
tPLZ Output Disable Time(3) CL = 10 pF 6 9 15 35 ns
S1 Closed
S2 Open
tPHZ Output Disable Time(3) CL = 10 pF 4 7 15 25 ns
S1 Open
S2 Closed
tPZL Output Enable Time CL = 30 pF 14 20 20 30 ns
S1 Closed
S2 Open
tPZH Output Enable Time CL = 30 pF 11 17 20 30 ns
S1 Open
S2 Closed
(1) This table is provided for comparison purposes only. The values in this table for the DS26C31 reflect the performance of the device but are not tested or verified.
(2) Skew is defined as the difference in propagation delays between complementary outputs at the 50% point.
(3) Output disable time is the delay from ENABLE or ENABLE being switched to the output transistors turning off. The actual disable times are less than indicated due to the delay added by the RC time constant of the load.

7.6 Typical Characteristics

00857414.pngFigure 1. Differential Propagation Delay vs Temperature
00857416.pngFigure 3. Differential Skew vs Temperature
00857418.pngFigure 5. Differential Transition Time vs Temperature
00857420.pngFigure 7. Complementary Skew vs Temperature
00857422.pngFigure 9. Differential Output Voltage vs Output Current
00857424.pngFigure 11. Output High Voltage vs Output High Current
00857426.pngFigure 13. Output Low Voltage vs Output Low Current
00857428.pngFigure 15. Supply Current vs Temperature
00857427.pngFigure 17. Output Low Voltage vs Output Low Current
00857429.pngFigure 19. Supply Current vs Power Supply Voltage
00857433.pngFigure 21. Output Short Circuit Current vs Power Supply Voltage
00857415.pngFigure 2. Differential Propagation Delay vs Power Supply Voltage
00857417.pngFigure 4. Differential Skew vs Power Supply Voltage
00857419.pngFigure 6. Differential Transition Time vs Power Supply Voltage
00857421.pngFigure 8. Complementary Skew vs Power Supply Voltage
00857423.pngFigure 10. Differential Output Voltage vs Output Current
00857425.pngFigure 12. Output High Voltage vs Output High Current
00857427.pngFigure 14. Output Low Voltage vs Output Low Current
00857426.pngFigure 16. Output Low Voltage vs Output Low Current
00857428.pngFigure 18. Supply Current vs Temperature
00857432.pngFigure 20. Output Short Circuit Current vs Temperature