ZHCSCD5B April   2014  – January 2017 DS125DF1610

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Additional Thermal Information
    6. 6.6 Electrical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Data Path Operation
      2. 7.3.2  AC-Coupled Receiver with Signal Detect
      3. 7.3.3  CTLE
      4. 7.3.4  Cross Point Switch
      5. 7.3.5  DFE with VGA
      6. 7.3.6  Clock and Data Recovery
      7. 7.3.7  Reference Clock
      8. 7.3.8  Differential Driver with FIR Filter
      9. 7.3.9  Setting the Output VOD
      10. 7.3.10 Output Driver Polarity Inversion
      11. 7.3.11 Driver Output Rise/Fall Time
      12. 7.3.12 Debug Features
        1. 7.3.12.1 Pattern Generator
        2. 7.3.12.2 Pattern Checker
        3. 7.3.12.3 Eye Opening Monitor
      13. 7.3.13 Interrupt Signals
      14. 7.3.14 Other Features
        1. 7.3.14.1 Lock Sequencer
        2. 7.3.14.2 RESET_IO Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Master Mode
      2. 7.4.2 SMBus Slave Mode
        1. 7.4.2.1 SDA and SDC
        2. 7.4.2.2 SMBus Address Configuration
      3. 7.4.3 Device Configuration in SMBus Slave Mode
    5. 7.5 Programming
      1. 7.5.1 Bit Fields in the Register Set
      2. 7.5.2 Writing to and Reading from the Global/Shared/Channel Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Typical Application Performance Plots
    3. 8.3 Initialization Setup
      1. 8.3.1 Data Rate Selection (Rate/Sub-Rate Table)
      2. 8.3.2 Data Rate Selection (Manual Programming)
  9. Power Supply Recommendations
    1. 9.1 Power Supply Filtering
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from A Revision (December 2015) to B Revision

  • Changed 最低温度为 -20°C 至 -40°CGo
  • Changed the minimum temperature from -20°C to -40°C Go

Changes from * Revision (April 2014) to A Revision

  • Added 完整的数据表Go