ZHCSCD5B April   2014  – January 2017 DS125DF1610

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Additional Thermal Information
    6. 6.6 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Data Path Operation
      2. 7.3.2  AC-Coupled Receiver with Signal Detect
      3. 7.3.3  CTLE
      4. 7.3.4  Cross Point Switch
      5. 7.3.5  DFE with VGA
      6. 7.3.6  Clock and Data Recovery
      7. 7.3.7  Reference Clock
      8. 7.3.8  Differential Driver with FIR Filter
      9. 7.3.9  Setting the Output VOD
      10. 7.3.10 Output Driver Polarity Inversion
      11. 7.3.11 Driver Output Rise/Fall Time
      12. 7.3.12 Debug Features
        1. 7.3.12.1 Pattern Generator
        2. 7.3.12.2 Pattern Checker
        3. 7.3.12.3 Eye Opening Monitor
      13. 7.3.13 Interrupt Signals
      14. 7.3.14 Other Features
        1. 7.3.14.1 Lock Sequencer
        2. 7.3.14.2 RESET_IO Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Master Mode
      2. 7.4.2 SMBus Slave Mode
        1. 7.4.2.1 SDA and SDC
        2. 7.4.2.2 SMBus Address Configuration
      3. 7.4.3 Device Configuration in SMBus Slave Mode
    5. 7.5 Programming
      1. 7.5.1 Bit Fields in the Register Set
      2. 7.5.2 Writing to and Reading from the Global/Shared/Channel Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Typical Application Performance Plots
    3. 8.3 Initialization Setup
      1. 8.3.1 Data Rate Selection (Rate/Sub-Rate Table)
      2. 8.3.2 Data Rate Selection (Manual Programming)
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Filtering
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.2 文档支持

11.2.1 相关文档

请参阅如下相关文档：

11.3 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。请单击右上角的通知我 进行注册，即可收到任意产品信息更改每周摘要。有关更改的详细信息，请查看任意已修订文档中包含的修订历史记录。

11.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.