ZHCSMX4D September   2020  – March 2022 DRV8300

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings Comm
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Three BLDC Gate Drivers
        1. 8.3.1.1 Gate Drive Timings
          1. 8.3.1.1.1 Propagation Delay
          2. 8.3.1.1.2 Deadtime and Cross-Conduction Prevention
        2. 8.3.1.2 Mode (Inverting and non inverting INLx)
      2. 8.3.2 Pin Diagrams
      3. 8.3.3 Gate Driver Protective Circuits
        1. 8.3.3.1 VBSTx Undervoltage Lockout (BSTUV)
        2. 8.3.3.2 GVDD Undervoltage Lockout (GVDDUV)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Bootstrap Capacitor and GVDD Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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7.3 Recommended Operating Conditions

over operating temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VGVDD Power supply voltage GVDD 5 20 V
VSHx High-side source pin voltage SHx -2 85 V
VSHx Transient 2µs high-side source pin voltage SHx -22 85 V
VBST Bootstrap pin voltage BSTx 5 105 V
VBST Bootstrap pin voltage BSTx with respect to SHx 5 20 V
VIN Logic input voltage INHx, INLx, MODE, DT 0 GVDD V
fPWM PWM frequency INHx, INLx 0 200 kHz
VSHSL Slew rate on SHx pin (DRV8300D and DRV8300DI) 2 V/ns
VSHSL Slew rate on SHx pin (DRV8300N and DRV8300NI) 50 V/ns
CBOOT(1) Capacitor between BSTx and SHx (DRV8300D and DRV8300DI) 1 µF
TA Operating ambient temperature –40 125 °C
TJ Operating junction temperature –40 150 °C