ZHCSE69E November   2014  – May 2025 DLP9500UV

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 说明(续)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  LVDS Timing Requirements
    8. 6.8  LVDS Waveform Requirements
    9. 6.9  Serial Control Bus Timing Requirements
    10. 6.10 Systems Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Chipset Component Usage Specification
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410—Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200 - DMD Micromirror Drivers
      3. 7.3.3 DLPR410—PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP9500—DLP 0.95 1080p 2xLVDS UV Type-A DMD 1080p DMD
        1. 7.3.4.1 DLP9500UV 1080p Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP9500UV Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP9500UV Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single Block Mode
      2. 7.4.2 Dual Block Mode
      3. 7.4.3 Quad Block Mode
      4. 7.4.4 Global Block Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Package Thermal Resistance
      2. 7.6.2 Case Temperature
      3. 7.6.3 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DMD Reflectivity Characteristics
        1. 8.1.1.1 Design Considerations Influencing DMD Reflectivity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Device Description
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Up Sequence (Handled by the DLPC410)
      2. 8.3.2 DMD Power-Up and Power-Down Procedures
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Impedance Requirements
        2. 8.4.1.2 PCB Signal Routing
        3. 8.4.1.3 Fiducials
        4. 8.4.1.4 PCB Layout Guidelines
          1. 8.4.1.4.1 DMD Interface
            1. 8.4.1.4.1.1 Trace Length Matching
          2. 8.4.1.4.2 DLP9500UV Decoupling
            1. 8.4.1.4.2.1 Decoupling Capacitors
          3. 8.4.1.4.3 VCC and VCC2
          4. 8.4.1.4.4 DMD Layout
          5. 8.4.1.4.5 DLPA200
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Device Marking
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Related Links
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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订购信息

Micromirror Array Optical Characteristics

TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical performance involves making trade-offs between numerous component and system design parameters. See the related application reports (listed in Related Links) for guidelines.

PARAMETERTEST CONDITIONSMINNOMMAXUNIT
aMicromirror tilt angleDMD parked state (1) (2) (3), See Figure 7-60degrees
DMD landed state (1) (4) (5)
See Figure 7-6
12
βMicromirror tilt angle variation (1) (4) (6) (7) (8)See Figure 7-6-11degrees
Micromirror crossover time (9)3µs
Micromirror switching time (10)12.5µs
Array switching time at 400MHz with global reset (11)56µs
Non-operating micromirrors (12)Non-adjacent micromirrors10micromirrors
Adjacent micromirrors0
Orientation of the micromirror axis-of-rotation (13)See Figure 7-6444546degrees
Micromirror array optical efficiency (14) (15) 363nm to 420nm, with all micromirrors in the ON state68%
Window materialCorning 7056
Window artifact sizeWithin the window aperture(16)400μm
Window aperture See (17)
Measured relative to the plane formed by the overall micromirror array.
Parking the micromirror array returns all of the micromirrors to an essentially flat (0°) state (as measured relative to the plane formed by the overall micromirror array).
When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.
Additional variation exists between the micromirror array and the package datums, as shown in Mechanical, Packaging, and Orderable Information.
When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in a nominal angular position of +12°. A binary value of 0 results in a micromirror landing in a nominal angular position of –12°.
Represents the landed tilt angle variation relative to the nominal landed tilt angle.
Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations and/or system contrast variations.
Micromirror crossover time is the transition time from landed to landed during a crossover transition and is primarily a function of the natural response time of the micromirrors.
Micromirror switching time is the time after a micromirror clocking pulse until the micromirrors can be addressed again. It included the micromirror settling time.
Array switching is controlled and coordinated by the DLPC410 and DLPA200. Nominal switching time depends on the system implementation and represents the time for the entire micromirror array to be refreshed (array loaded plus reset and mirror settling time).
Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the –12° position to +12° or vice versa.
Measured relative to the package datums 'B' and 'C', shown in the Mechanical, Packaging, and Orderable Information.
The minimum or maximum DMD optical efficiency observed in a specific application depends on numerous application-specific design variables, such as:
  • Illumination wavelength, bandwidth/line width, degree of coherence
  • Illumination angle, plus angle tolerance
  • Illumination and projection aperture size, and location in the system optical path
  • Illumination overfill of the DMD micromirror array
  • Aberrations present in the illumination source and/or path
  • Aberrations present in the projection path

The specified nominal DMD optical efficiency is based on the following use conditions:
  • UV illumination (363nm to 420nm)
  • Input illumination optical axis oriented at 24° relative to the window normal
  • Projection optical axis oriented at 0° relative to the window normal
  • ƒ / 3.0 illumination aperture
  • ƒ / 2.4 projection aperture

Based on these use conditions, the nominal DMD optical efficiency results from the following four components:
  • Micromirror array fill factor: nominally 94%
  • Micromirror array diffraction efficiency: nominally 85%
  • Micromirror surface reflectivity: nominally 89%
  • Window transmission: nominally 98% (single pass, through two surface transitions)
Does not account for the effect of micromirror switching duty cycle, which is application-dependent. The micromirror switching duty cycle represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
See Mechanical, Packaging, and Orderable Information for details regarding the size and location of the window aperture.
Refers only to non-cleanable artifacts. See the DMD S4xx Glass Cleaning Procedure and DMD S4xx Handling Specifications for recommended handling and cleaning processes.