ZHCSR38A
November 2022 – September 2023
DLP801RE
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
12
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
16
6.8
System Mounting Interface Loads
18
6.9
Micromirror Array Physical Characteristics
20
6.10
Micromirror Array Optical Characteristics
22
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Power Density Calculation
7.8
Window Aperture Illumination Overfill Calculation
7.9
Micromirror Landed-On/Landed-Off Duty Cycle
7.9.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.9.2
Landed Duty Cycle and Useful Life of the DMD
7.9.3
Landed Duty Cycle and Operational DMD Temperature
7.9.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Temperature Sensor Diode
9
Power Supply Recommendations
9.1
DMD Power Supply Requirements
9.2
DMD Power Supply Power-Up Procedure
9.3
DMD Power Supply Power-Down Procedure
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.2.1
Layers
10.2.2
Impedance Requirements
10.2.3
Trace Width, Spacing
10.2.3.1
Voltage Signals
11
Device and Documentation Support
11.1
第三方产品免责声明
11.2
Device Support
11.2.1
Device Nomenclature
11.3
Device Markings
11.4
Documentation Support
11.4.1
Related Documentation
11.5
接收文档更新通知
11.6
支持资源
11.7
Trademarks
11.8
静电放电警告
11.9
术语表
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
封装选项
机械数据 (封装 | 引脚)
FYV|350
MCCC010
散热焊盘机械数据 (封装 | 引脚)
11.8
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。