ZHCSJ27 November   2018 DLP650LNIR

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Micromirror Array Physical Characteristics
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 System Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410: Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200: DMD Micromirror Driver
      3. 7.3.3 DLPR410: PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP650LNIR: DLP 0.65 WXGA NIR 2xLVDS Series 450 DMD
        1. 7.3.4.1 DLP650LNIR Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP650LNIR Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP650LNIR Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Operational Modes
      1. 7.4.1 DMD Block Modes
        1. 7.4.1.1 Single Block Mode
        2. 7.4.1.2 Dual Block Mode
        3. 7.4.1.3 Quad Block Mode
        4. 7.4.1.4 Global Mode
      2. 7.4.2 DMD Load4 Mode
    5. 7.5 Feature Description
      1. 7.5.1 Power Interface
      2. 7.5.2 Timing
    6. 7.6 Optical Interface and System Image Quality Considerations
      1. 7.6.1 Optical Interface and System Image Quality
      2. 7.6.2 Numerical Aperture and Stray Light Control
      3. 7.6.3 Pupil Match
      4. 7.6.4 Illumination Overfill
    7. 7.7 Micromirror Temperature Calculations
      1. 7.7.1 Sample Calculation 1: Uniform Illumination of Entire DMD Active Array (1280 × 800 pixels)
      2. 7.7.2 Sample Calculation 2: Partial DMD Active Array Illumination with Non-uniform Illumination Peak
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Description
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
      4. 10.1.4 DMD Interface
        1. 10.1.4.1 Trace Length Matching
      5. 10.1.5 DLP650LNIR Decoupling
        1. 10.1.5.1 Decoupling Capacitors
      6. 10.1.6 VCC and VCC2
      7. 10.1.7 DMD Layout
      8. 10.1.8 DLPA200
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC DLP650LNIR UNIT
FYL Package
149 PINS
RSILICON-TO-CERAMIC: Thermal resistance, silicon to ceramic, as measured at test point 1 (TP1)(1) 0.5 °C/W
RMIRROR-TO-SILICON: Thermal resistance, mirror to silicon, per individual mirror (1) 3.39 × 105 °C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of maintaining the package within the temperature range specified in the Recommended Operating Conditions.
The total heat load on the DMD is largely driven by the incident light absorbed by the micromirrror array, although other contributions include light energy outside of the active mirror array and electrical power dissipation of the silicon.
Design the optical system to minimized light outside of the active micromirror array because light outside of this area gets highly absorbed by the optical border and increases DMD heat load.
Design the optical system to minimize the light energy falling outside the window clear aperture. Aditional thermal load in this area contributes to window heating and significantly degrades the reliability of the device.