ZHCSN33B November   2017  – February 2023 DLP550JE

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Window Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Micromirror Array Physical Characteristics
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Feature Description
      1. 7.2.1 Power Interface
      2. 7.2.2 Timing
   3. 7.3 Optical Interface and System Image Quality Considerations
      1. 7.3.1 Numerical Aperture and Stray Light Control
      2. 7.3.2 Pupil Match
      3. 7.3.3 Illumination Overfill
   4. 7.4 Micromirror Array Temperature Calculation
      1. 7.4.1 Micromirror Array Temperature Calculation
   5. 7.5 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.5.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.5.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.5.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.5.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
9. 9 Power Supply Recommendations
   1. 9.1 DMD Power-Up and Power-Down Procedures
10. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 第三方产品免责声明
       2. 10.1.2 Device Nomenclature
       3. 10.1.3 Device Markings
    2. 10.2 支持资源
       1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
11. 11Mechanical, Packaging, and Orderable Information