ZHCSN33C November   2017  – December 2024 DLP550JE

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
    8. 5.8  Window Characteristics
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Power Interface
      2. 6.2.2 Timing
    3. 6.3 Optical Interface and System Image Quality Considerations
      1. 6.3.1 Numerical Aperture and Stray Light Control
      2. 6.3.2 Pupil Match
      3. 6.3.3 Illumination Overfill
    4. 6.4 Micromirror Array Temperature Calculation
      1. 6.4.1 Micromirror Array Temperature Calculation
    5. 6.5 Micromirror Power Density Calculation
    6. 6.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 6.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
    1. 8.1 DMD Power-Up and Power-Down Procedures
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
      2. 9.1.2 Device Nomenclature
      3. 9.1.3 Device Markings
    2. 9.2 支持资源
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision B (February 2023) to Revision C (December 2024)

  • 通篇将主控制器更新为 DLPC4420Go
  • 更新了图 3-1 Go
  • 添加了 DLPC4420 作为支持的显示控制器Go
  • 添加了 DLP 产品第三方搜索工具链接,以及 TI DLP 显示技术入门链接Go
  • Added sections SOLID STATE ILLUMINATION and LAMP ILLUMINATION to Recommended Operating Conditions table.Go
  • Expanded and updated table Micromirror Array Optical CharacteristicsGo
  • Changed Micromirror Array Temperature CalculationGo
  • Added section Micromirror Power Density Calculation.Go
  • Changed the orderables to show as replaced by the DLP550JE.Go
  • Added links to DLPC4420 and DLPA200 data sheets.Go

Changes from Revision A (September 2022) to Revision B (February 2023)

  • 将控制器更新为 DLPC4430,所有芯片组元件均为有效链接Go
  • 将控制器更新为 DLPC4430,将 DMD 链接到文档Go
  • Updated this sectionGo
  • Updated controller to DLPC4430, updated the application diagramGo
  • Updated controller to DLPC4430Go
  • Updated controller to DLPC4430Go