ZHCSP44D October   2021  – October 2024 DLP160CP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
    8. 5.8  Switching Characteristics
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application—nHD Mode
      2. 7.2.2 Typical Application—HD Mode
      3. 7.2.3 Design Requirements
      4. 7.2.4 Detailed Design Procedure
      5. 7.2.5 Application Curve
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Power-Up Procedure
    2. 8.2 Power Supply Power-Down Procedure
    3. 8.3 Power Supply Sequencing Requirements
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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8.3 Power Supply Sequencing Requirements

DLP160CP Power Supply Sequencing Requirements (Power Up and Power Down)
A. Refer to the Power-Up Sequence Delay Requirement for critical power-up sequence delay requirements.
B. To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified in Section 5.4. OEMs may find that the most reliable way to ensure this is to power VOFFSET prior to VBIAS during power-up and to remove VBIAS prior to VOFFSET during power-down. Refer to Power-Up Sequence Delay Requirement for power-up delay requirements.
C. To prevent excess current, the supply voltage delta |VBIAS – VRESET| must be less than the specified limit shown in Section 5.4.
D. When system power is interrupted, the DLPA200x/DLPA3000 initiates hardware power-down that disables VBIAS, VRESET, and VOFFSET after the micromirror park sequence.
E. The drawing is not to scale and details are omitted for clarity.
Figure 8-1 Power Supply Sequencing Requirements (Power Up and Power Down)
Table 8-1 Power-Up Sequence Delay Requirement
PARAMETERMINMAXUNIT
tDELAYDelay requirement from VOFFSET power up to VBIAS power up2ms
VOFFSETThe supply voltage level at the beginning of power-up sequence delay6V
VBIASThe supply voltage level at end of power-up sequence delay6V
DLP160CP Power-Up Sequence Delay Requirement
This requirement applies only to the DLPA200x.
Refer to Power-Up Sequence Delay Requirement for VOFFSET and VBIAS supply voltage levels during power-up sequence delay.
Figure 8-2 Power-Up Sequence Delay Requirement