ZHCSAY0D March   2013  – April 2015 CSD87588N

PRODUCTION DATA.  

  1. 1特性
  2. 2应用范围
  3. 3说明
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Power Block Performance
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Device Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Power Loss Curves
      2. 6.1.2 Safe Operating Curves (SOA)
      3. 6.1.3 Normalized Curves
      4. 6.1.4 Calculating Power Loss and SOA
        1. 6.1.4.1 Design Example
        2. 6.1.4.2 Calculating Power Loss
        3. 6.1.4.3 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Electrical Performance
      2. 7.1.2 Thermal Performance
    2. 7.2 Layout Example
  8. 8器件和文档支持
    1. 8.1 商标
    2. 8.2 静电放电警告
    3. 8.3 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 CSD87588N 封装尺寸
    2. 9.2 焊盘布局建议
    3. 9.3 模板建议 (100µm)
    4. 9.4 模板建议 (125µm)
    5. 9.5 引脚图
    6. 9.6 CSD87588N 压纹载带尺寸

封装选项

机械数据 (封装 | 引脚)
  • MPA|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (June 2014) to D Revision

Changes from B Revision (January 2014) to C Revision

  • 将“无铅引脚镀层”更改成了“无铅”Go

Changes from A Revision (May 2013) to B Revision

Changes from * Revision (March 2013) to A Revision