ZHCSHY1 March 2018 CSD86356Q5D
PRODUCTION DATA.
| THERMAL METRIC | MIN | MAX | UNIT | |
|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance (min Cu)(1) | 125 | °C/W | |
| RθJA | Junction-to-ambient thermal resistance (max Cu)(1)(2) | 50 | °C/W | |
| RθJC | Junction-to-case thermal resistance (top of package)(1) | 12 | °C/W | |
| RθJC | Junction-to-case thermal resistance (PGND pin)(1) | 1.8 | °C/W | |