ZHCSVL4E October   2009  – November 2024 CSD16301Q2

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 接收文档更新通知
    2. 5.2 支持资源
    3. 5.3 Trademarks
    4. 5.4 静电放电警告
    5. 5.5 术语表
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.2 Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJCJunction-to-case thermal resistance(1)8.4°C/W
RθJAJunction-to-ambient thermal resistance(1)(2)65°C/W
(1) RθJC is determined with the device mounted on a 1in2 (6.45cm2), 2oz (0.071mm) thick Cu pad on a 1.5in × 1.5in (3.81cm × 3.81cm), 0.06in (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1in2 (6.45cm2), 2oz (0.071mm) thick Cu.

CSD16301Q2
Max RθJA = 65°C/W when mounted on 1in2 (6.45cm2) of 2oz (0.071mm) thick Cu.
CSD16301Q2
Max RθJA = 250°C/W when mounted on minimum pad area of 2oz (0.071mm) thick Cu.