ZHCSBM6A September   2013  – January 2018 CSD13202Q2

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     Device Images
  4. 4修订历史记录
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Characteristics
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 商标
    4. 6.4 静电放电警告
    5. 6.5 Glossary
  7. 7机械、封装和可订购信息
    1. 7.1 Q2 封装尺寸
      1. 7.1.1 建议 PCB 布局
      2. 7.1.2 推荐的模版布局
    2. 7.2 Q2 卷带信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 Thermal Characteristics

TA = 25°C unless otherwise stated
PARAMETERMINTYPMAXUNIT
RθJC Thermal resistance junction-to-case(1) 6.4 °C/W
RθJA Thermal resistance junction-to-ambient(1)(2) 60 °C/W
(1) RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu.

CSD13202Q2 M0164-01_LPS235.gif
 Max RθJA = 60 when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
CSD13202Q2 M0164-02_LPS235.gif
 Max RθJA = 210 when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu.