ZHCSKG5B October   2019  – February 2021 CC2652P

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 修订历史记录
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       36
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.5 Power Consumption - Power Modes

When measured on the  CC1352PEM-XD7793-XD24-PA24 reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. 
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 150
Standby
without cache retention		 RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF		 0.94 µA
RTC running, CPU, 80KB RAM and (partial) register retention
XOSC_LF		 1.09 µA
Standby
with cache retention		 RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF		 3.2 µA
RTC running, CPU, 80KB RAM and (partial) register retention.
XOSC_LF		 3.3 µA
Idle Supply Systems and RAM powered
RCOSC_HF		 675 µA
Active MCU running CoreMark at 48 MHz
RCOSC_HF		 3.39 mA
Peripheral Current Consumption(1)(2)
Iperi Peripheral power domain Delta current with domain enabled 97.7 µA
Serial power domain Delta current with domain enabled 7.2
RF Core Delta current with power domain enabled,
clock enabled, RF core idle		 210.9
µDMA Delta current with clock enabled, module is idle 63.9
Timers Delta current with clock enabled, module is idle(5) 81.0
I2C Delta current with clock enabled, module is idle 10.1
I2S Delta current with clock enabled, module is idle 26.3
SSI Delta current with clock enabled, module is idle 82.9
UART Delta current with clock enabled, module is idle(3) 167.5
CRYPTO (AES) Delta current with clock enabled, module is idle(4)
25.6
PKA Delta current with clock enabled, module is idle
 84.7
TRNG Delta current with clock enabled, module is idle
 35.6
Sensor Controller Engine Consumption
ISCE Active mode 24 MHz, infinite loop 808.5 µA
Low-power mode 2 MHz, infinite loop 30.1
(1) Adds to core current Icore for each peripheral unit activated.
(2) Iperi is not supported in Standby or Shutdown modes.
(3) Only one UART running
(4) Only one SSI running
(5) Only one GPTimer running