ZHCSFX3A April   2016  – November 2016 CC2564C

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 VQFN-MR Pin Diagram
      1. 4.1.1 Pin Attributes (VQFN-MR Package)
      2. 4.1.2 Connections for Unused Signals (VQFN-MR Package)
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On Hours
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Power Consumption Summary
      1. 5.5.1 Static Current Consumption
      2. 5.5.2 Dynamic Current Consumption
        1. 5.5.2.1 Current Consumption for Different Bluetooth BR and EDR Scenarios
        2. 5.5.2.2 Current Consumption for Different Low-Energy Scenarios
    6. 5.6 Electrical Characteristics
    7. 5.7 Thermal Resistance Characteristics for VQFN-MR (RVM) Package
    8. 5.8 Timing and Switching Characteristics
      1. 5.8.1 Device Power Supply
        1. 5.8.1.1 Power Sources
        2. 5.8.1.2 Device Power-Up and Power-Down Sequencing
        3. 5.8.1.3 Power Supplies and Shutdown—Static States
        4. 5.8.1.4 I/O States in Various Power Modes
        5. 5.8.1.5 nSHUTD Requirements
      2. 5.8.2 Clock Specifications
        1. 5.8.2.1 Slow Clock Requirements
        2. 5.8.2.2 External Fast Clock Crystal Requirements and Operation
        3. 5.8.2.3 Fast Clock Source Requirements (-40°C to +85°C)
      3. 5.8.3 Peripherals
        1. 5.8.3.1 UART
        2. 5.8.3.2 PCM
      4. 5.8.4 RF Performance
        1. 5.8.4.1 Bluetooth BR and EDR RF Performance
          1. 5.8.4.1.1 Bluetooth Receiver—In-Band Signals
          2. 5.8.4.1.2 Bluetooth Receiver—General Blocking
          3. 5.8.4.1.3 Bluetooth Transmitter—GFSK
          4. 5.8.4.1.4 Bluetooth Transmitter—EDR
          5. 5.8.4.1.5 Bluetooth Modulation—GFSK
          6. 5.8.4.1.6 Bluetooth Modulation—EDR
          7. 5.8.4.1.7 Bluetooth Transmitter—Out-of-Band and Spurious Emissions
        2. 5.8.4.2 Bluetooth low energy RF Performance
          1. 5.8.4.2.1 Bluetooth low energy Receiver—In-Band Signals
          2. 5.8.4.2.2 Bluetooth low energy Receiver—General Blocking
          3. 5.8.4.2.3 Bluetooth low energy Transmitter
          4. 5.8.4.2.4 Bluetooth low energy Modulation
          5. 5.8.4.2.5 Bluetooth low energy Transceiver, Out-Of-Band and Spurious Emissions
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Clock Inputs
      1. 6.3.1 Slow Clock
      2. 6.3.2 Fast Clock Using External Clock Source
        1. 6.3.2.1 External FREF DC-Coupled
        2. 6.3.2.2 External FREF Sine Wave, AC-Coupled
        3. 6.3.2.3 Fast Clock Using External Crystal
    4. 6.4 Functional Blocks
      1. 6.4.1 RF
        1. 6.4.1.1 Receiver
        2. 6.4.1.2 Transmitter
      2. 6.4.2 Host Controller Interface
        1. 6.4.2.1 4-Wire UART Interface—H4 Protocol
        2. 6.4.2.2 3-Wire UART Interface—H5 Protocol
      3. 6.4.3 Digital Codec Interface
        1. 6.4.3.1 Hardware Interface
        2. 6.4.3.2 I2S
        3. 6.4.3.3 Data Format
        4. 6.4.3.4 Frame-Idle Period
        5. 6.4.3.5 Clock-Edge Operation
        6. 6.4.3.6 Two-Channel Bus Example
      4. 6.4.4 Assisted Modes
        1. 6.4.4.1 Assisted HFP 1.6 (WBS)
        2. 6.4.4.2 Assisted A2DP
          1. 6.4.4.2.1 Assisted A2DP Sink
          2. 6.4.4.2.2 Assisted A2DP Source
    5. 6.5 Bluetooth BR and EDR Features
    6. 6.6 Bluetooth low energy Description
    7. 6.7 Bluetooth Transport Layers
    8. 6.8 Changes from the CC2564B Device to the CC2564C Device
  7. 7Applications, Implementation, and Layout
    1. 7.1 Reference Design Schematics and BOM for Power and Radio Connections
    2. 7.2 PCB Layout Guidelines
      1. 7.2.1 General PCB Guidelines
      2. 7.2.2 Power Supply Guidelines
      3. 7.2.3 User Interfaces
      4. 7.2.4 Clock Interfaces
      5. 7.2.5 RF Interface
  8. 8器件和文档支持
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 工具与软件
    3. 8.3 器件命名规则
    4. 8.4 Community Resources
    5. 8.5 商标
    6. 8.6 静电放电警告
    7. 8.7 Glossary
  9. 9机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RVM|76
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 Device Comparison

Table 3-1 lists the features of the CC2564C device.

Table 3-1 CC2564C Device Features

DEVICE DESCRIPTION TECHNOLOGY SUPPORTED ASSISTED MODES SUPPORTED(1)
BR, EDR LOW ENERGY HFP 1.6 (WBS) A2DP
CC2564C Bluetooth 4.2 + Bluetooth low energy √ √ √ √
(1) The assisted modes (HFP 1.6 and A2DP) are not supported simultaneously. Furthermore, the assisted modes are not supported simultaneously with Bluetooth low energy.

3.1 Related Products

    Wireless Connectivity

    The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of application. The offerings range from fully customized solutions to turnkey offerings with precertified hardware and software (protocol).

    Companion Products

    Review products that are frequently purchased or used with the CC2564C product.

    Reference Designs for CC2564

    The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns.