ZHCSU80
December 2023
CC2340R2
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
功能方框图
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagram – RGE Package (Top View)
6.2
Signal Descriptions – RGE Package
6.3
Connections for Unused Pins and Modules – RGE Package
6.4
RGE Peripheral Pin Mapping
6.5
RGE Peripheral Signal Descriptions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
DCDC
7.5
Global LDO (GLDO)
7.6
Power Supply and Modules
7.7
Battery Monitor
7.8
Temperature Sensor
7.9
Power Consumption - Power Modes
7.10
Power Consumption - Radio Modes
7.11
Nonvolatile (Flash) Memory Characteristics
7.12
Thermal Resistance Characteristics
7.13
RF Frequency Bands
7.14
Bluetooth Low Energy - Receive (RX)
7.15
Bluetooth Low Energy - Transmit (TX)
7.16
2.4 GHz RX/TX CW
7.17
Timing and Switching Characteristics
7.17.1
Reset Timing
7.17.2
Wakeup Timing
7.17.3
Clock Specifications
7.17.3.1
48 MHz Crystal Oscillator (HFXT)
7.17.3.2
48 MHz RC Oscillator (HFOSC)
7.17.3.3
32 kHz Crystal Oscillator (LFXT)
7.17.3.4
32 kHz RC Oscillator (LFOSC)
7.18
Peripheral Characteristics
7.18.1
UART
7.18.1.1
UART Characteristics
7.18.2
SPI
7.18.2.1
SPI Characteristics
7.18.2.2
SPI Controller Mode
7.18.2.3
SPI Timing Diagrams - Controller Mode
7.18.2.4
SPI Peripheral Mode
7.18.2.5
SPI Timing Diagrams - Peripheral Mode
7.18.3
I2C
7.18.3.1
I2C
7.18.3.2
I2C Timing Diagram
7.18.4
GPIO
7.18.4.1
GPIO DC Characteristics
7.18.5
ADC
7.18.5.1
Analog-to-Digital Converter (ADC) Characteristics
7.18.6
Comparators
7.18.6.1
Ultra-low power comparator
7.19
Typical Characteristics
7.19.1
MCU Current
7.19.2
RX Current
7.19.3
TX Current
7.19.4
RX Performance
7.19.5
TX Performance
7.19.6
ADC Performance
8
Detailed Description
8.1
Overview
8.2
System CPU
8.3
Radio (RF Core)
8.3.1
Bluetooth 5.3 Low Energy
8.4
Memory
8.5
Cryptography
8.6
Timers
8.7
Serial Peripherals and I/O
8.8
Battery and Temperature Monitor
8.9
µDMA
8.10
Debug
8.11
Power Management
8.12
Clock Systems
8.13
Network Processor
9
Application, Implementation, and Layout
9.1
Reference Designs
9.2
Junction Temperature Calculation
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.2.1
SimpleLink™ Microcontroller Platform
10.3
Documentation Support
10.4
支持资源
10.5
Trademarks
10.6
静电放电警告
10.7
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RKP|40
MPQF261B
RGE|24
MPQF124G
散热焊盘机械数据 (封装 | 引脚)
RKP|40
QFND309E
RGE|24
QFND008AA
订购信息
zhcsu80_oa
7.18
Peripheral Characteristics