ZHCSCF9 May   2014 BUF16821-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Two-Wire Bus Overview
      2. 7.3.2 Data Rates
      3. 7.3.3 General-Call Reset and Power-Up
      4. 7.3.4 Output Voltage
      5. 7.3.5 Updating the DAC Output Voltages
      6. 7.3.6 DIE_ID and DIE_REV Registers
      7. 7.3.7 Read and Write Operations
        1. 7.3.7.1 Read and Write: DAC and VCOM Register (Volatile Memory)
        2. 7.3.7.2 Writing: DAC and VCOM Register (Volatile Memory)
        3. 7.3.7.3 Reading: DAC, VCOM, Other Register (Volatile Memory)
        4. 7.3.7.4 Write: Nonvolatile Memory for the DAC Register
        5. 7.3.7.5 Read: Nonvolatile Memory for the DAC Register
      8. 7.3.8 Output Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 End-User Selected Gamma Control
      2. 7.4.2 Dynamic Gamma Control
    5. 7.5 Programming
      1. 7.5.1 Addressing the Device
      2. 7.5.2 Nonvolatile Memory
        1. 7.5.2.1 BKSEL Pin
        2. 7.5.2.2 General Acquire Command
        3. 7.5.2.3 Single-Channel Acquire Command
        4. 7.5.2.4 MaxBank
        5. 7.5.2.5 Parity Error Correction
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PowerPAD Design Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

PWP Package
HTSSOP-28
(Top View)
po_bos712.gif
1. GNDA and GNDD must be connected together.

Pin Functions

PIN DESCRIPTION
NO. NAME
1 VCOM2 VCOM channel 2
2 OUT1 DAC output 1
3 OUT2 DAC output 2
4 OUT3 DAC output 3
5 OUT4 DAC output 4
6 OUT5 DAC output 5
7 OUT6 DAC output 6
8 GNDA Analog ground; must be connected to digital ground (GNDD).
9 VS VS connected to analog supply
10 OUT7 DAC output 7
11 OUT8 DAC output 8
12 OUT9 DAC output 9
13 VSD Digital supply; connect to logic supply
14 SCL Serial clock input; open-drain, connect to pull-up resistor.
15 SDA Serial data I/O; open-drain, connect to pull-up resistor.
16 A0 A0 address pin for I2C address; connect to either logic 1 or logic 0; refer to Table 2.
17 BKSEL Selects memory bank 0 or 1; connect to either logic 1 to select bank 1 or logic 0 to select bank 0.
18 GNDD Digital ground; must be connected to analog ground at the BUF16821-Q1.
19 OUT10 DAC output 10
20 OUT11 DAC output 11
21 OUT12 DAC output 12
22 OUT13 DAC output 13
23 VS VS connected to analog supply
24 GNDA Analog ground; must be connected to digital ground (GNDD).
25 OUT14 DAC output 14
26 OUT15 DAC output 15
27 OUT16 DAC output 16
28 VCOM1 VCOM channel 1