ZHCSCF9 May   2014 BUF16821-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Two-Wire Bus Overview
      2. 7.3.2 Data Rates
      3. 7.3.3 General-Call Reset and Power-Up
      4. 7.3.4 Output Voltage
      5. 7.3.5 Updating the DAC Output Voltages
      6. 7.3.6 DIE_ID and DIE_REV Registers
      7. 7.3.7 Read and Write Operations
        1. 7.3.7.1 Read and Write: DAC and VCOM Register (Volatile Memory)
        2. 7.3.7.2 Writing: DAC and VCOM Register (Volatile Memory)
        3. 7.3.7.3 Reading: DAC, VCOM, Other Register (Volatile Memory)
        4. 7.3.7.4 Write: Nonvolatile Memory for the DAC Register
        5. 7.3.7.5 Read: Nonvolatile Memory for the DAC Register
      8. 7.3.8 Output Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 End-User Selected Gamma Control
      2. 7.4.2 Dynamic Gamma Control
    5. 7.5 Programming
      1. 7.5.1 Addressing the Device
      2. 7.5.2 Nonvolatile Memory
        1. 7.5.2.1 BKSEL Pin
        2. 7.5.2.2 General Acquire Command
        3. 7.5.2.3 Single-Channel Acquire Command
        4. 7.5.2.4 MaxBank
        5. 7.5.2.5 Parity Error Correction
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PowerPAD Design Considerations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 机械封装和可订购信息

以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。