ZHCSD75D March 2014 – January 2018
The battery current transmission path through the FETs should be routed with large copper pours to provide the lowest resistance path possible to the system. Depending on package type, thermal vias can be placed in the package land pattern's thermal pad to reduce thermal impedance and improve heat dissipation from the package to the board, protecting the FETs during high system loading conditions. In addition, it is preferable to locate the FETs and other heat generating components away from the low power pack electronics to reduce the chance of temperature drift and associated impacts to data converter measurements. In the event of FET overheating, keeping reasonable distance between the most critical components, such as the fuel gauge, and the FETs helps to decrease the risk of thermal breakdown to the more fragile components.