ZHCSD75D March   2014  – January 2018

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power-On Reset
    6. 6.6  2.5-V LDO Regulator
    7. 6.7  Charger Attachment and Removal Detection
    8. 6.8  CHG and DSG FET Drive
    9. 6.9  Overvoltage Protection (OVP)
    10. 6.10 Undervoltage Protection (UVP)
    11. 6.11 Overcurrent in Discharge (OCD)
    12. 6.12 Overcurrent in Charge (OCC)
    13. 6.13 Short-Circuit in Discharge (SCD)
    14. 6.14 Low Voltage Charging
    15. 6.15 Internal Temperature Sensor Characteristics
    16. 6.16 High-Frequency Oscillator
    17. 6.17 Low-Frequency Oscillator
    18. 6.18 Integrating ADC (Coulomb Counter) Characteristics
    19. 6.19 ADC (Temperature and Cell Voltage) Characteristics
    20. 6.20 Data Flash Memory Characteristics
    21. 6.21 Timing Requirements
    22. 6.22 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Configuration
      2. 7.3.2 Fuel Gauging
      3. 7.3.3 Power Modes
        1. 7.3.3.1 NORMAL Mode
        2. 7.3.3.2 SLEEP Mode
        3. 7.3.3.3 FULLSLEEP Mode
      4. 7.3.4 Li-Ion Battery Protector Description
        1. 7.3.4.1 High-Side NFET Charge and Discharge FET Drive
        2. 7.3.4.2 Protector Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
        1. 7.4.1.1 NORMAL Mode
        2. 7.4.1.2 OVERVOLTAGE Mode
        3. 7.4.1.3 UNDERVOLTAGE Mode
        4. 7.4.1.4 OVERCURRENT IN CHARGE Mode
        5. 7.4.1.5 OVERCURRENT IN DISCHARGE and SHORT-CIRCUIT IN DISCHARGE Mode
        6. 7.4.1.6 SHUTDOWN WAIT Mode
          1. 7.4.1.6.1 ANALOG SHUTDOWN State
        7. 7.4.1.7 LOW VOLTAGE CHARGING State
      2. 7.4.2 Firmware Control of Protector
      3. 7.4.3 OVERTEMPERATURE FAULT Mode
      4. 7.4.4 Wake-Up Comparator
    5. 7.5 Battery Parameter Measurements
      1. 7.5.1 Charge and Discharge Counting
      2. 7.5.2 Voltage
      3. 7.5.3 Current
      4. 7.5.4 Auto-Calibration
      5. 7.5.5 Temperature
    6. 7.6 Communications
      1. 7.6.1 HDQ Single-Pin Serial Interface
      2. 7.6.2 I2C Interface
        1. 7.6.2.1 I2C Time Out
        2. 7.6.2.2 I2C Command Waiting Time
    7. 7.7 Standard Data Commands
      1. 7.7.1 Control(): 0x00 and 0x01
    8. 7.8 Extended Data Commands
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Pack-Side, Single-Cell Li-Ion Fuel Gauge and Protector
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1  BAT Voltage Sense Input
        2. 8.2.3.2  SRP and SRN Current Sense Inputs
        3. 8.2.3.3  Sense Resistor Selection
        4. 8.2.3.4  TS Temperature Sense Input
        5. 8.2.3.5  Thermistor Selection
        6. 8.2.3.6  VPWR Power Supply Input Filtering
        7. 8.2.3.7  REG25 LDO Output Filtering
        8. 8.2.3.8  Communication Interface Lines
        9. 8.2.3.9  PACKP Voltage Sense Input
        10. 8.2.3.10 CHG and DSG Charge Pump Voltage Outputs
        11. 8.2.3.11 NFET Selection
        12. 8.2.3.12 Additional ESD Protection Components
      4. 8.2.4 Application Curves
  9. Power Supply Recommendation
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Li-Ion Cell Connections
      2. 10.1.2 Sense Resistor Connections
      3. 10.1.3 Thermistor Connections
      4. 10.1.4 FET Connections
      5. 10.1.5 ESD Component Connections
      6. 10.1.6 High Current and Low Current Path Separation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Extended Data Commands

Extended commands offer additional functionality beyond the standard set of commands. They are used in the same manner; however unlike standard commands, extended commands are not limited to 2-byte words. The number of command bytes for a given extended command ranges in size from single to multiple bytes, as specified in Table 10. For details on the SEALED and UNSEALED states, see the Access Modes section in the bq27742-G1 Technical Reference Manual (SLUUAX0).

Table 10. Extended Commands

NAME COMMAND CODE UNIT SEALED
ACCESS(1)(2)
UNSEALED
ACCESS(1)(2)
PackConfiguration() 0x3A and 0x3B Hex R R
DesignCapacity() 0x3C and 0x3D mAh R R
DataFlashClass()(2) 0x3E NA NA RW
DataFlashBlock()(2) 0x3F NA RW RW
BlockData()/Authenticate()(3) 0x40 to 0x53 NA RW RW
BlockData()/AuthenticateCheckSum()(3) 0x54 NA RW RW
BlockData() 0x55 to 0x5F NA R RW
BlockDataCheckSum() 0x60 NA RW RW
BlockDataControl() 0x61 NA NA RW
DODatEOC() 0x62 and 0x63 NA R R
Qstart() 0x64 and 0x65 mAh R R
FastQmax() 0x66 and 0x67 mAh R R
Reserved 0x68 to 0x6C NA R R
ProtectorStatus() 0x6D Hex R R
Reserved 0x6E and 0x6F NA R R
SimultaneousCurrent() 0x70 and 0x71 mA R R
Reserved 0x72 and 0x73 NA R R
FETTest() 0x74 and 0x75 Hex R RW
AveragePower() 0x76 and 0x77 mW or cW R R
ProtectorState() 0x78 Hex R R
AN_COUNTER 0x79
AN_CURRENT_LSB 0x7A
AN_CURRENT_MSB 0x7B
AN_VCELL_LSB 0x7C
AN_VCELL_MSB 0x7D
AN_TEMP_LSB 0x7E
AN_TEMP_MSB 0x7F
SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01
In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F.
The BlockData() command area shares functionality for accessing general data flash and for using Authentication. See Authentication in the bq27742-G1 Technical Reference Manual (SLUUAX0) for more details.