ZHCSD75D March 2014 – January 2018
PRODUCTION DATA.
| THERMAL METRIC(1) | bq27742-G1 | UNIT | |
|---|---|---|---|
| YZF (DSBGA) | |||
| 15 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 70 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 17 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | NA | °C/W |