ZHCSD75D March   2014  – January 2018

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power-On Reset
    6. 6.6  2.5-V LDO Regulator
    7. 6.7  Charger Attachment and Removal Detection
    8. 6.8  CHG and DSG FET Drive
    9. 6.9  Overvoltage Protection (OVP)
    10. 6.10 Undervoltage Protection (UVP)
    11. 6.11 Overcurrent in Discharge (OCD)
    12. 6.12 Overcurrent in Charge (OCC)
    13. 6.13 Short-Circuit in Discharge (SCD)
    14. 6.14 Low Voltage Charging
    15. 6.15 Internal Temperature Sensor Characteristics
    16. 6.16 High-Frequency Oscillator
    17. 6.17 Low-Frequency Oscillator
    18. 6.18 Integrating ADC (Coulomb Counter) Characteristics
    19. 6.19 ADC (Temperature and Cell Voltage) Characteristics
    20. 6.20 Data Flash Memory Characteristics
    21. 6.21 Timing Requirements
    22. 6.22 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Configuration
      2. 7.3.2 Fuel Gauging
      3. 7.3.3 Power Modes
        1. 7.3.3.1 NORMAL Mode
        2. 7.3.3.2 SLEEP Mode
        3. 7.3.3.3 FULLSLEEP Mode
      4. 7.3.4 Li-Ion Battery Protector Description
        1. 7.3.4.1 High-Side NFET Charge and Discharge FET Drive
        2. 7.3.4.2 Protector Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
        1. 7.4.1.1 NORMAL Mode
        2. 7.4.1.2 OVERVOLTAGE Mode
        3. 7.4.1.3 UNDERVOLTAGE Mode
        4. 7.4.1.4 OVERCURRENT IN CHARGE Mode
        5. 7.4.1.5 OVERCURRENT IN DISCHARGE and SHORT-CIRCUIT IN DISCHARGE Mode
        6. 7.4.1.6 SHUTDOWN WAIT Mode
          1. 7.4.1.6.1 ANALOG SHUTDOWN State
        7. 7.4.1.7 LOW VOLTAGE CHARGING State
      2. 7.4.2 Firmware Control of Protector
      3. 7.4.3 OVERTEMPERATURE FAULT Mode
      4. 7.4.4 Wake-Up Comparator
    5. 7.5 Battery Parameter Measurements
      1. 7.5.1 Charge and Discharge Counting
      2. 7.5.2 Voltage
      3. 7.5.3 Current
      4. 7.5.4 Auto-Calibration
      5. 7.5.5 Temperature
    6. 7.6 Communications
      1. 7.6.1 HDQ Single-Pin Serial Interface
      2. 7.6.2 I2C Interface
        1. 7.6.2.1 I2C Time Out
        2. 7.6.2.2 I2C Command Waiting Time
    7. 7.7 Standard Data Commands
      1. 7.7.1 Control(): 0x00 and 0x01
    8. 7.8 Extended Data Commands
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Pack-Side, Single-Cell Li-Ion Fuel Gauge and Protector
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1  BAT Voltage Sense Input
        2. 8.2.3.2  SRP and SRN Current Sense Inputs
        3. 8.2.3.3  Sense Resistor Selection
        4. 8.2.3.4  TS Temperature Sense Input
        5. 8.2.3.5  Thermistor Selection
        6. 8.2.3.6  VPWR Power Supply Input Filtering
        7. 8.2.3.7  REG25 LDO Output Filtering
        8. 8.2.3.8  Communication Interface Lines
        9. 8.2.3.9  PACKP Voltage Sense Input
        10. 8.2.3.10 CHG and DSG Charge Pump Voltage Outputs
        11. 8.2.3.11 NFET Selection
        12. 8.2.3.12 Additional ESD Protection Components
      4. 8.2.4 Application Curves
  9. Power Supply Recommendation
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Li-Ion Cell Connections
      2. 10.1.2 Sense Resistor Connections
      3. 10.1.3 Thermistor Connections
      4. 10.1.4 FET Connections
      5. 10.1.5 ESD Component Connections
      6. 10.1.6 High Current and Low Current Path Separation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

Pin Functions

NUMBER NAME I/O DESCRIPTION
A1 SRP I Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK+ connection. Connect to a sense resistor.
A2 CHG O External high side N-channel charge FET driver
A3 DSG O External high side N-channel discharge FET driver
B1 SRN I Analog input pin connected to the internal coulomb counter where SRN is nearest the CELL+ connection. Connect to a sense resistor.
B2 NC IO Not used. Reserved for future GPIO. It is recommended to connect to GND.
B3 PACKP I Pack voltage measurement input for protector operation
C1 VPWR Power input. Decouple with 0.1-µF ceramic capacitor to VSS.
C2 BAT I Cell-voltage measurement input. ADC input
C3 SDA IO Slave I2C serial communications data line for communication with system. Open-drain I/O. Use with a 10-kΩ pullup resistor (typical).
D1 VSS Device ground
D2 HDQ I/O HDQ serial communications line. Open-drain
D3 RC2 IO General purpose IO. Push-pull output
E1 REG25 Regulator output and bq27742-G1 processor power. Decouple with 1.0-µF ceramic capacitor to VSS.
E2 TS I Pack thermistor voltage sense (use 103AT-type thermistor). ADC input
E3 SCL IO Slave I2C serial communications clock input line for communication with system. Use with a 10-kΩ pullup resistor (typical).

Table 1. Hardware Protection Thresholds(1)

OVERVOLTAGE PROTECTION (VOVP) UNDERVOLTAGE PROTECTION (VUVP) OVERCURRENT IN CHARGE (VOCC) OVERCURRENT IN DISCHARGE (VOCD) SHORT-CIRCUIT IN DISCHARGE (VSCD)
4.450 V 2.438 V 6 mV 14 mV 73 mV
24 mV
13 mV 34 mV
44 mV
18 mV 53 mV 148 mV
63 mV
28 mV 73 mV
83 mV
4.425 V 2.422 V 6 mV 13 mV 73 mV
23 mV
13 mV 33 mV
43 mV
18 mV 53 mV 148 mV
63 mV
28 mV 72 mV
83 mV
4.400 V 2.409 V 6 mV 13 mV 72 mV
23 mV
13 mV 33 mV
43 mV
18 mV 52 mV 147 mV
62 mV
28 mV 72 mV
82 mV
4.375 V 2.395 V 6 mV 13 mV 72 mV
23 mV
13 mV 33 mV
42 mV
18 mV 52 mV 146 mV
62 mV
28 mV 72 mV
82 mV
4.350 V 2.381 V 6 mV 13 mV 71 mV
23 mV
13 mV 32 mV
42 mV
18 mV 52 mV 145 mV
62 mV
28 mV 71 mV
81 mV
4.325 V 2.368 V 6 mV 13 mV 71 mV
22 mV
13 mV 32 mV
42 mV
18 mV 52 mV 144 mV
61 mV
27 mV 71 mV
81 mV
4.300 V 2.354 V 6 mV 13 mV 71 mV
22 mV
13 mV 32 mV
42 mV
18 mV 51 mV 143 mV
61 mV
27 mV 70 mV
80 mV
4.275 V 2.340 V 6 mV 13 mV 70 mV
22 mV
13 mV 32 mV
41 mV
18 mV 51 mV 143 mV
60 mV
27 mV 70 mV
80 mV
Production tested in the following configuration: VOVP = 4.450 V, VUVP = 2.438 V, VOCC = 28 mV, VOCD = 83 mV, and VSCD = 148 mV.

Table 2. Hardware Protection Delays

OVERVOLTAGE PROTECTION DELAY (tOVP) UNDERVOLTAGE PROTECTION DELAY (tUVP) OVERCURRENT IN CHARGE DELAY (tOCC) OVERCURRENT IN DISCHARGE DELAY (tOCD) SHORT-CIRCUIT IN DISCHARGE DELAY (tSCD)
1.00 s 31.25 ms 7.81 ms 31.25 ms 312.50 µs