ZHCSPC2C
September 2021 – January 2023
BQ25180
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Thermal Information
7.4
Recommended Operating Conditions
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.1.1
Battery Charging Process
8.1.1.1
Trickle Charge
8.1.1.2
Precharge
8.1.1.3
Fast Charge
8.1.1.4
Termination
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Input Voltage Based Dynamic Power Management (VINDPM)
8.3.2
Dynamic Power Path Management Mode (DPPM)
8.3.3
Battery Supplement Mode
8.3.4
SYS Power Control (SYS_MODE bit control)
8.3.4.1
SYS Pulldown Control
8.3.5
SYS Regulation
8.3.6
ILIM Control
8.3.7
Protection Mechanisms
8.3.7.1
Input Overvoltage Protection
8.3.7.2
Battery Undervoltage Lockout
8.3.7.3
System Overvoltage Protection
8.3.7.4
System Short Protection
8.3.7.5
Battery Overcurrent Protection
8.3.7.6
Safety Timer and Watchdog Timer
8.3.7.7
Thermal Protection and Thermal Regulation
8.3.8
Pushbutton Wake and Reset Input
8.3.8.1
Pushbutton Wake or Short Button Press Functions
8.3.8.2
Pushbutton Reset or Long Button Press Functions
8.3.9
15-Second Timeout for HW Reset
8.3.10
Hardware Reset
8.3.11
Software Reset
8.3.12
Interrupt Indicator (/INT) Pin
8.3.13
External NTC Monitoring (TS)
8.3.13.1
TS Biasing and Function
8.3.14
I2C Interface
8.3.14.1
F/S Mode Protocol
8.4
Device Functional Modes
8.5
Register Maps
8.5.1
I2C Registers
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Input (IN/SYS) Capacitors
9.2.2.2
TS
9.2.2.3
Recommended Passive Components
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
第三方产品免责声明
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
YBG|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcspc2c_oa
zhcspc2c_pm
9.2.2.3
Recommended Passive Components
Table 9-2 Passive Components
MIN
NOM
MAX
UNIT
C
SYS
Capacitance on SYS pin
1
10
100
μF
C
BAT
Capacitance on BAT pin
1
1
-
μF
C
IN
IN input bypass capacitance
1
1
10
μF