ZHCSCJ9B February   2013  – May 2015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Performance Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Protection
        1. 8.3.1.1 Input Overvoltage Protection
        2. 8.3.1.2 Bad Adaptor Detection/Rejection
        3. 8.3.1.3 Sleep Mode
        4. 8.3.1.4 Input Voltage Based DPM (Special Charger Voltage Threshold)
      2. 8.3.2  Battery Protection
        1. 8.3.2.1 Output Overvoltage Protection
        2. 8.3.2.2 Battery Short Protection
        3. 8.3.2.3 Battery Detection in HOST Mode
      3. 8.3.3  DEFAULT Mode
      4. 8.3.4  USB Friendly Power Up
      5. 8.3.5  Input Current Limiting at Power Up
      6. 8.3.6  Factory Mode
      7. 8.3.7  Spread Spectrum Mode
      8. 8.3.8  PWM Controller in Charge Mode
      9. 8.3.9  Battery Charging Process
      10. 8.3.10 Thermal Regulation and Protection
      11. 8.3.11 Charge Status Output, STAT Pin
      12. 8.3.12 Control Bits in Charge Mode
        1. 8.3.12.1 CE Bit (Charge Mode)
        2. 8.3.12.2 RESET Bit
        3. 8.3.12.3 OPA_MODE Bit
      13. 8.3.13 Control Pins in Charge Mode
        1. 8.3.13.1 CD Pin (Charge Disable)
      14. 8.3.14 Boost Mode Operation
        1. 8.3.14.1 PWM Controller in Boost Mode
        2. 8.3.14.2 Boost Start Up
        3. 8.3.14.3 PFM Mode at Light Load
        4. 8.3.14.4 Protection in Boost Mode
          1. 8.3.14.4.1 Output Overvoltage Protection
          2. 8.3.14.4.2 Output Overload Protection
          3. 8.3.14.4.3 Battery Overvoltage Protection
        5. 8.3.14.5 STAT Pin in Boost Mode
      15. 8.3.15 High Impedance (Hi-Z) Mode
      16. 8.3.16 Serial Interface Description
        1. 8.3.16.1 F/S Mode Protocol
        2. 8.3.16.2 HS Mode Protocol
        3. 8.3.16.3 I2C Update Sequence
        4. 8.3.16.4 Slave Address Byte
        5. 8.3.16.5 Register Address Byte
    4. 8.4 Device Functional Modes
      1. 8.4.1 Charge Mode Operation
        1. 8.4.1.1 Charge Profile
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Charge Current Sensing Resistor Selection Guidelines
        2. 9.2.2.2 Output Inductor and Capacitance Selection Guidelines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 System Load After Sensing Resistor
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息
    1. 13.1 封装概要
      1. 13.1.1 芯片尺寸级封装尺寸

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更，恕不另行通知和修订此文档。如欲获取此数据表的浏览器版本，请参阅左侧的导航。

13.1 封装概要

bq24157S package_summary_lusb76.gif
0 引脚 A1 标记，TI-TI 字符，YM = 年月日日期代码，LLL = 批次追踪代码，S = 组装地点代码

13.1.1 芯片尺寸级封装尺寸

bq24157S 器件采用 20 焊锡凸块芯片尺寸封装 (DSBGA， NanoFree™)。

封装尺寸为：

D E
最大值 = 2.17mm 最大值 = 2.03mm
最小值 = 2.11mm 最小值 = 1.97mm