SLUS618I August   2004  – December 2014

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Power Flow Diagram
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Device Options
  8. 8 Pin Configuration and Functions
  9. 9 Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 Thermal Information
    5. 9.5 Dissipation Ratings
    6. 9.6 Electrical Characteristics
    7. 9.7 Typical Characteristics
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  bq24038 Differences
      2. 10.3.2  Power-Path Management
        1. 10.3.2.1 Case 1: AC Mode (PSEL = High)
          1. 10.3.2.1.1 System Power
          2. 10.3.2.1.2 Charge Control
          3. 10.3.2.1.3 Dynamic Power-Path Management (DPPM)
        2. 10.3.2.2 Case 2: USB (PSEL = Low) bq24030/31/32A/38
          1. 10.3.2.2.1 System Power
          2. 10.3.2.2.2 Charge Control
          3. 10.3.2.2.3 Dynamic Power-Path Management (DPPM)
          4. 10.3.2.2.4 Battery Temperature Monitoring
      3. 10.3.3  Charge Status Outputs
      4. 10.3.4  ACPG, USBPG Outputs (Power Good), bq24030/31/32A/35
      5. 10.3.5  PG Output (Power Good), bq24038
      6. 10.3.6  CE Input (Chip Enable)
      7. 10.3.7  VBSEL Input (Battery Voltage Selection), bq24038
      8. 10.3.8  DPPM Used As A Charge Disable Function
      9. 10.3.9  Timer Fault Recovery
      10. 10.3.10 Short-Circuit Recovery
      11. 10.3.11 LDO Regulator
    4. 10.4 Device Functional Modes
      1. 10.4.1 Sleep Mode - V(IN) < VI(BAT)
      2. 10.4.2 Standby Mode - V(IN) > VI(BAT)and CE (Chip Enable) Pin = Low
      3. 10.4.3 Battery Charge Mode - V(IN) > VI(BAT), Battery Present, CE Pin = High and DPPM Pin Not Floating
        1. 10.4.3.1 Autonomous Power Source Selection, PSEL Control Pin
      4. 10.4.4 Charge Control
        1. 10.4.4.1 Battery Pre-Conditioning
        2. 10.4.4.2 Battery Charge Current
        3. 10.4.4.3 Battery Voltage Regulation
        4. 10.4.4.4 Power Handoff
        5. 10.4.4.5 Temperature Regulation and Thermal Protection
        6. 10.4.4.6 Charge Timer Operation
        7. 10.4.4.7 Charge Termination and Recharge
      5. 10.4.5 Boot-Up Sequence
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Selecting the Input and Output Capacitors
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
    2. 14.2 Documentation Support
      1. 14.2.1 Related Documentation
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
  • RHL|20
散热焊盘机械数据 (封装 | 引脚)
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9 Specifications

9.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage AC (DC voltage with respect to VSS) –0.3 18 V
USB (DC voltage with respect to VSS) –0.3 7 V
Input voltage BAT, CE, DPPM, ACPG, PSEL, OUT, ISET1, ISET2, STAT1, STAT2, TS, USBPG , PG, VBSEL (all DC voltages with respect to VSS) –0.3 7 V
LDO (DC voltage with respect to VSS) –0.3 VO(OUT) + 0.3 V
TMR –0.3 VO(LDO) + 0.3 V
Input current AC 3.5 A
USB 1000 mA
Output current OUT 4 A
BAT(2) –4 3.5 A
Output source current (in regulation at 3.3 V LDO) LDO 30 mA
Output sink current ACPG, STAT1, STAT2, USBPG, PG 15 mA
Junction temperature, TJ –40 150 °C
Lead temperature (soldering, 10 seconds) 300 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.

9.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

9.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage (from AC input) (1)(2) bq24030/31/32A/35, bq24038 (at VBSEL = LOW) 4.35 16 V
bq24038 (at VBSEL = HIGH) 4.55 16
VCC Supply voltage (from USB input) (1) 4.35 6
IAC Input current, AC 2 A
IUSB Input current, USB 0.5
TJ Operating junction temperature range –40 125 °C
(1) VCC is defined as the greater of AC or USB input.
(2) Verify that power dissipation and junction temperatures are within limits at maximum VCC .

9.4 Thermal Information

THERMAL METRIC(1) bq2403x UNIT
RHL
20 PINS
RθJA Junction-to-ambient thermal resistance 40.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.0
RθJB Junction-to-board thermal resistance 16.6
ψJT Junction-to-top characterization parameter 0.7
ψJB Junction-to-board characterization parameter 16.6
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

9.5 Dissipation Ratings

PACKAGE TA ≤ 40°C
POWER RATING		 DERATING FACTOR
TA > 40°C		 θJA
20-pin RHL(1) 1.81 W 21 mW/°C 46.87 °C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is connected to the ground plane by a 2×3 via matrix.

9.6 Electrical Characteristics

over junction temperature range (0°C ≤ TJ ≤ 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT BIAS CURRENTS
ICC(SPLY) Active supply current, VCC VVCC > VVCC(min) 1 2 mA
ICC(SLP) Sleep current (current into BAT pin) V(AC) < V(BAT), V(USB) < V(BAT),
2.6 V ≤ VI(BAT) ≤ VO(BAT-REG),
Excludes load on OUT pin		 2 5 μA
ICC(AS-STDBY) AC standby current VI(AC) ≤ 6 V, Total current into AC pin with chip disabled, Excludes all loads, CE=LOW, after t(CE-HOLDOFF) delay 200
ICC(USB-STDBY) USB standby current Total current into USB pin with chip disabled, Excludes all loads, CE=LOW, after t(CE-HOLDOFF) delay 200
ICC(BAT-STDBY) BAT standby current Total current into BAT pin with AC and/or USB present and chip disabled; Excludes all loads (OUT and LDO),
CE=LOW, after t(CE-HOLDOFF) delay, 0°C ≤ TJ ≤ 85°C(1)		 45 60
IIB(BAT) Charge done current, BAT Charge DONE, AC or USB supplying the load 1 5
HIGH AC CUTOFF MODE
VCUT-OFF Input ac cutoff voltage, bq24035 VI(AC) > 6.8 V, AC FET (Q1) turns off, USB FET (Q3) turns on if USB power present, otherwise BAT FET (Q2) turns on. 6.1 6.4 6.8 V
LDO OUTPUT
VO(LDO) Output regulation voltage Active only if AC or USB is present,
VI(OUT) ≥ VO(LDO) + (IO(LDO) × RDS(on))		 3.3 V
Regulation accuracy(2) –5% 5%
IO(LDO) Output current 20 mA
RDS(on) On resistance OUT to LDO 50 Ω
C(OUT)(3) Output capacitance 1 μF
OUT PIN-VOLTAGE REGULATION(4)
VO(OUT-REG) Output regulation voltage bq24030/31 VI(AC) ≥ 6 V+VDO 6.0 6.3 V
bq24032A VI(AC) ≥ 4.4 V+VDO 4.4 4.5
bq24038 VBSEL = HIGH or VBSEL = LOW, VI(AC) > 4.4 V+VDO 4.4 4.5
OUT PIN – DPPM REGULATION
V(DPPM-SET) DPPM set point(5) VDPPM-SET < VOUT 2.6 5 V
I(DPPM-SET) DPPM current source AC or USB present 95 100 105 μA
SF DPPM scale factor V(DPPM-REG)= V(DPPM-SET) × SF 1.139 1.150 1.162
OUT PIN – FET (Q1, Q3, AND Q2) DROP-OUT VOLTAGE (RDSon)
V(ACDO) AC to OUT dropout voltage(6) VI(AC) ≥ VCC(min), PSEL = High, II(AC) = 1 A,
(IO(OUT)+ IO(BAT)), or no AC		 300 475 mV
V(USBDO)(13) USB to OUT dropout voltage VI(USB) ≥ VCC(min), PSEL = Low, ISET2 = High,
II(USB) = 0.4 A, (IO(OUT)+IO(BAT)), or no AC		 140 180
VI(USB) ≥ VCC(min), PSEL = Low, ISET2 = Low,
II(USB) = 0.08 A, (IO(OUT)+ IO(BAT))		 28 36
V(BATDO) BAT to OUT dropout voltage (discharging) VI (BAT) ≥ 3 V, Ii(BAT)= 1.0 A, VCC < Vi(BAT) 40 100 mV
OUT PIN - BATTERY SUPPLEMENT MODE
VBSUP1 Enter battery supplement mode (battery supplements OUT current in the presence of input source VI(BAT)> 2 V VI(OUT)
≤ VI(BAT) 
– 60 mV		 V
VBSUP2 Exit battery supplement mode VI(BAT)> 2 V VI(OUT)
≥ VI(BAT) 
– 20 mV
OUT PIN - SHORT CIRCUIT
IOSH1 BAT to OUT short-circuit recovery Current source between BAT to OUT for short-circuit recovery to VI(OUT) ≤ VI(BAT) –200 mV 10 mA
RSHAC AC to OUT short-circuit limit VI(OUT)  ≤ 1 V 500 Ω
RSHVSB USB to OUT short-circuit limit VI(OUT)  ≤ 1 V 500
BAT PIN CHARGING – PRECHARGE
V(LOWV) Precharge to fast-charge transition threshold Voltage on BAT 2.9 3 3.1 V
TDGL(F) Deglitch time for fast-charge to precharge transition(12) tFALL = 100 ns, 10 mV overdrive,
VI(BAT) decreasing below threshold		 22.5 ms
IO(PRECHG) Precharge range 1 V < VI(BAT) < V(LOWV), t < t(PRECHG),
IO(PRECHG) = (K(SET)× V(PRECHG))/ RSET		 10 150 mA
V(PRECHG) Precharge set voltage 1 V < VI(BAT) < V(LOWV), t < t(PRECHG) 230 250 270 mV
BAT PIN CHARGING - CURRENT REGULATION
IO(BAT) AC battery charge current range(7) Vi (BAT) > V(LOWV), VI(OUT) - VI (BAT) > V(DO-MAX),
PSEL = High IOUT(BAT) = (K(SET) × V(SET) / RSET),
VI(OUT) > VO(OUT-REG) + V(DO-MAX)		 100 1000 1500 mA
RPBAT BAT to OUT pullup Vi (BAT)< 1 V 1000 Ω
RPOUT AC to OUT and USB to OUT short-circuit pullup VI(OUT) < 1 V 500
V(SET) Battery charge current set voltage(8) Voltage on ISET1, VVCC ≥ 4.35 V,
VI(OUT)- VI(BAT) > V(DO-MAX), VI(BAT) > V(LOWV)		 2.475 2.500 2.525 V
K(SET) Charge current set factor, BAT 100 mA ≤ IO(BAT) ≤ 1 A 400 425 450
10 mA ≤ IO(BAT) ≤ 100 mA(9) 300 450 600
USB PIN INPUT CURRENT REGULATION
I(USB) USB input current range, bq24030/32A/35/38(11) VI(BAT) > V(LOWV), VI(USB) - VI(BAT) > V(DO-MAX),
ISET2= Low, PSEL = Low, or no AC (10)		   100 mA
VI(BAT) > V(LOWV),
VI(USB) - VI(BAT) > V(DO-MAX), ISET2= High,
PSEL = Low, or no AC (11)		 400   500
BAT PIN CHARGING VOLTAGE REGULATION, VO (BAT-REG) + V (DO-MAX) < VCC, ITERM < IBAT(OUT) ≤ 1 A
VO(BAT-REG) Battery charge voltage bq24030/32A/35 4.2 V
bq24031 4.1
bq24038 VBSEL = HI 4.36
VBSEL = LO 4.2
Battery charge voltage regulation accuracy TA = 25°C –0.5% 0.5%
–1% 1%
CHARGE TERMINATION DETECTION
I(TERM) Charge termination detection range VI(BAT) < V(RCH), I(TERM) = (K(SET) × V(TERM))/ RSET 10 150 mA
V(TERM-AC) AC-charge termination detection voltage, measured on ISET1 VI(BAT) > V(RCH) , PSEL = High, ACPG = Low 235 250 265 mV
V(TAPER-USB) USB-charge termination detection voltage, measured on ISET1 VI(BAT) > V(RCH), PSEL = Low or
PSEL = High and ACPG = High		 95 100 130 mV
TDGL(TERM) Deglitch time for termination detection tFALL = 100 ns, 10 mV overdrive,
ICHG increasing above or decreasing below threshold 		22.5 ms
TEMPERATURE SENSE COMPARATORS
VLTF High voltage threshold Temp fault at V(TS) > VLTF 2.465 2.500 2.535 V
VHTF Low voltage threshold Temp fault at V(TS) < VHTF 0.485 0.500 0.515 V
ITS Temperature sense current source 94 100 106 μA
TDGL(TF) Deglitch time for temperature fault detection(12) R(TMR) = 50 kΩ, VI(BAT) increasing or decreasing above and below; 100-ns fall time, 10-mv overdrive 22.5 ms
BATTERY RECHARGE THRESHOLD
VRCH Recharge threshold voltage VO(BAT-REG)
–0.075		 VO(BAT-REG)
–0.100		 VO(BAT-REG)
–0.125		 V
TDGL(RCH) Deglitch time for recharge detection(12) R(TMR) = 50 kΩ, VI(BAT) increasing
or decreasing below threshold,
100-ns fall time, 10-mv overdrive		 22.5 ms
STAT1, STAT2. ACPG AND USBPG, PG OPEN DRAIN (OD) OUTPUTS(15)
VOL Low-level output saturation voltage IOL = 5 mA, An external pullup
resistor ≥ 1 K required.		 0.25 V
ILKG Input leakage current 1 5 μA
ISET2, CE, VBSEL INPUTS
VIL Low-level input voltage 0 0.4 V
VIH High-level input voltage 1.4
IIL Low-level input current, CE –1 μA
IIH High-level input current, CE 1
IIL Low-level input current, ISET2 VISET2 = 0 V –20
IIH High-level input current, ISET2 VISET2 = VCC 40
IIL1 Low-level input current VBSEL = Low 6 1
IIH1 High-level input current VBSEL = High 15
t(CE-HLDOFF) Holdoff time, CE CE going low only 3.3 6.2 ms
PSEL INPUT
VIL Low-level input voltage Falling Hi→Low; 280 K ± 10% applied when low. 0.975 1 1.025 V
VIH High-level input voltage Input RPSEL sets external hysteresis VIL + 0.01 VIL + 0.024 V
IIL Low-level input current, PSEL –1 μA
IIH High-level input current, PSEL μA
TIMERS
K(TMR) Timer set factor t(CHG) = K(TMR) × R(TMR) 0.313 0.360 0.414 s/Ω
R(TMR)(14) External resistor limits 30 100 kΩ
t(PRECHG) Precharge timer 0.09 × t(CHG) 0.10 × t(CHG) 0.11 × t(CHG) s
I(FAULT) Timer fault recovery pullup from OUT to BAT 1 kΩ
CHARGER SLEEP THRESHOLDS (ACPG , PG, and USBPG THRESHOLDS, LOW → POWER GOOD)
V(SLPENT)(19) Sleep-mode entry threshold V(UVLO) ≤ VI(BAT) ≤ VO(BAT-REG),
No t(BOOT-UP) delay		 VVCC ≤
VI(BAT)
+125 mV		 V
V(SLPEXIT)(19) Sleep-mode exit threshold V(UVLO) ≤ VI(BAT) ≤ VO(BAT-REG),
No t(BOOT-UP) delay		 VVCC ≥
VI(BAT)
+190 mV
t(DEGL) Deglitch time for sleep mode(16) R(TMR) = 50 kΩ,
V(AC) or V(USB) or decreasing below threshold, 100-ns fall time, 10-mv overdrive		 22.5 ms
START-UP CONTROL and USB BOOT-UP
t(BOOT-UP) Boot-up time On the first application of USB input power or AC input with PSEL Low 120 150 180 ms
SWITCHING POWER SOURCE TIMING
tSW-BAT Switching power source from inputs (AC or USB) to battery Only AC power or USB power applied. Measure from:
[xxPG: Lo → Hi to I(xx) > 5 mA],
xx = AC or USB I(OUT) = 100 mA, RTRM = 50 K		 50 μs
tSW-AC/USB Switching from AC to USB, or, USB to AC by input source removal. (17) Measure from:
I(AC) < 5 mA to I(USB) > 5 mA or I(USB)
< 5 mA → I(AC) > 5 mA;
I(OUT) = 100 mA, RTMR = 50 K,
ISET2 = hi, ROUT > 15 Ω, VDPPM = 2.5 V		 100
tSW-PSEL Switching from AC to USB, or USB to AC by toggling PSEL 50 100
THERMAL SHUTDOWN REGULATION(18)
T(SHTDWN) Temperature trip TJ (Q1 and Q3 only) 155 °C
Thermal hysteresis TJ (Q1 and Q3 only) 30
TJ(REG) Temperature regulation limit TJ (Q2) 115 135
UVLO
V(UVLO) Undervoltage lockout Decreasing VCC 2.45 2.50 2.65 V
Hysteresis 27 mV
(1) This includes the quiescent current for the integrated LDO.
(2) In standby mode (CE low) the accuracy is ±10%.
(3) LDO output capacitor not required but one with a value of 0.1 μF is recommended.
(4) When power is applied to the USB pin and PSEL is low, the USB input is switched straight through to the OUT pin (not regulated). This voltage may drop to the DPPM-OUT threshold or battery voltage (which ever is higher) if the USB input current limit is active.
(5) V(DPPM-SET) is scaled up by the scale factor for controlling the output voltage V(DPPM-REG).
(6) VDO(max), dropout voltage is a function of the FET, RDS(on), and drain current. The dropout voltage increases proportionally to the increase in current.
(7) When input current remains below 2 A, the battery charging current may be raised until the thermal regulation limits the charge current.
(8) For half-charge rate, V(SET) is 1.25 V ± 25 mV for bq24032A/38 only.
(9) Specification is for monitoring charge current via the ISET1 pin during voltage regulation mode, not for a reduced fast-charge level.
(10) With the PSEL= low, the bqTINY III-series defaults to USB charging. If USB input is ≤ VBAT, then the bqTINY III-series charges from the AC input at the USB charge rate. In this configuration, the specification is 80 mA (min) and 100 mA (max).
(11) With the PSEL= low, the bqTINY III-series defaults to USB charging. If USB input is ≤ VBAT, then the bqTINY III-series charges from the AC input at the USB charge rate. In this configuration, the specification is 400 mA (min) and 500 mA (max).
(12) All deglitch periods are a function of the timer setting and is modified in DPPM or thermal regulation modes by the percentages that the program current is reduced.
(13) RDS(on) of USB FET Q3 is calculated by: (VUSB – VOUT) / (IOUT + IBAT) when II(USB) ≤ II(USB-MIN) (FET fully on, not in regulation).
(14) To disable the fast-charge safety timer and charge termination, tie TMR to the LDO pin. Tying the TMR pin high changes the timing resistor from the external value to an internal 50 kΩ ±25%, which can add an additional tolerance to any timed spectification. The TMR pin normally regulates to 2.5 V when the charge current is not restricted by the DPPM or thermal feedback loops. If these loops become active, the TMR pin voltage will be reduced proportionally to the reduction in charge current and the clock frequency will be reduced by the same percentage (timed durations will count down slower, extending their time). The TMR pin is clamped at 0.80 V, for a maximum time extension of 2.5 V ÷ 0.8 V × 100 = 310%.
(15) See Charger Sleep mode for ACPG (VCC = VAC) and USBPG (VCC = VUSB) specifications.
(16) Does not declare sleep mode until after the deglitch time and implement the needed power transfer immediately according to the switching specification.
(17) The power handoff is implemented once the PG pin goes high (removed sources PG) which is when the removed source drops to the battery voltage. If the battery voltage is critically low, the system may lose power unless the system takes control of the PSEL pin and switches to the available power source prior to shutdown. The USB source often has less current available; so, the system may have to reduce its load when switching from AC to USB.
(18) Reaching thermal regulation reduces the charging current. Battery supplement current is not restricted by either thermal regulation or shutdown. Input power FETs turn off during thermal shutdown. The battery FET is only protected by a short-circuit limit which typically does not cause a thermal shutdown (input FETs turning off) by itself.
(19) The IC is considered in sleep mode when both AC and USB are absent (ACPG = USBPG = OPEN DRAIN).

9.7 Typical Characteristics

sigma_lus694.gif
Figure 1. Typical OUT Voltage Regulation, bq24032A