ZHCSNQ2C March   2021  – January 2024 AWR1843AOP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Pin Functions - Digital and Analog [ALP Package]
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Supply Specifications
    6. 6.6  Power Consumption Summary
    7. 6.7  RF Specification
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1  Antenna Radiation Patterns
        1. 6.10.1.1 Antenna Radiation Patterns for Receiver
        2. 6.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 6.10.2  Antenna Positions
      3. 6.10.3  Power Supply Sequencing and Reset Timing
      4. 6.10.4  Input Clocks and Oscillators
        1. 6.10.4.1 Clock Specifications
      5. 6.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 6.10.5.1 Peripheral Description
        2. 6.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 6.10.5.2.1 SPI Timing Conditions
          2. 6.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 6.10.5.3 SPI Peripheral Mode I/O Timings
          1. 6.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 6.10.5.4 Typical Interface Protocol Diagram (Slave Mode)
      6. 6.10.6  LVDS Interface Configuration
        1. 6.10.6.1 LVDS Interface Timings
      7. 6.10.7  General-Purpose Input/Output
        1. 6.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-45 #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-50
      8. 6.10.8  Controller Area Network Interface (DCAN)
        1. 6.10.8.1 Dynamic Characteristics for the DCANx TX and RX Pins
      9. 6.10.9  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 6.10.9.1 Dynamic Characteristics for the CANx TX and RX Pins
      10. 6.10.10 Serial Communication Interface (SCI)
        1. 6.10.10.1 SCI Timing Requirements
      11. 6.10.11 Inter-Integrated Circuit Interface (I2C)
        1. 6.10.11.1 I2C Timing Requirements #GUID-64613E7E-5DDF-4B01-8FA0-13739060F368/T4362547-185
      12. 6.10.12 Quad Serial Peripheral Interface (QSPI)
        1. 6.10.12.1 QSPI Timing Conditions
        2. 6.10.12.2 Timing Requirements for QSPI Input (Read) Timings #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-210 #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-209
        3. 6.10.12.3 QSPI Switching Characteristics
      13. 6.10.13 ETM Trace Interface
        1. 6.10.13.1 ETMTRACE Timing Conditions
        2. 6.10.13.2 ETM TRACE Switching Characteristics
      14. 6.10.14 Data Modification Module (DMM)
        1. 6.10.14.1 DMM Timing Requirements
      15. 6.10.15 JTAG Interface
        1. 6.10.15.1 JTAG Timing Conditions
        2. 6.10.15.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 6.10.15.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 RF and Analog Subsystem
        1. 7.3.1.1 Clock Subsystem
        2. 7.3.1.2 Transmit Subsystem
        3. 7.3.1.3 Receive Subsystem
      2. 7.3.2 Processor Subsystem
      3. 7.3.3 Automotive Interface
      4. 7.3.4 Main Subsystem Cortex-R4F Memory Map
      5. 7.3.5 DSP Subsystem Memory Map
    4. 7.4 Other Subsystems
      1. 7.4.1 ADC Channels (Service) for User Application
        1. 7.4.1.1 GP-ADC Parameter
  9. 8 Monitoring and Diagnostics
    1. 8.1 Monitoring and Diagnostic Mechanisms
      1. 8.1.1 Error Signaling Module
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALP|180
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Revision History

Changes from July 20, 2022 to January 30, 2024 (from Revision B (July 2022) to Revision C (January 2024))

  • （功能方框图）：将合成器旁边的乘法器更新为 x4Go
  • (Functional Block Diagram) :Updated multiplier next to synthesizer to x4Go

Changes from September 15, 2021 to July 20, 2022 (from Revision A (September 2021) to Revision B (July 2022))

  • （特性）：更新/更改了 TX 功率和 RX 噪声Go
  • 通篇：已更新以反映功能安全合规性Go
  • （特性）：更新了功能安全合规性认证资料；提及了毫米波传感器的额定工作温度范围；更新了关于器件安全的其他信息 Go
  • （应用）：添加系统方框图Go
  • (Device Comparison) : Added a table-note for Functional-safety Compliance and LVDS Interface; Additional information on Device security aslo added.Go
  • Updated/changed temperature range max for Crystal Electrical Characteristics (Oscillator Mode)Go
  • (Table. External Clock Mode Specifications): Revised frequency tolerance specs from +/-50 to +/-100 ppmGo
  • (Monitoring and Diagnostic Mechanisms): Updated/Changed table header and description to reflect Functional Safety-Compliance; added a note for reference to safety related collateralGo