ZHCSNQ2C March   2021  – January 2024 AWR1843AOP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Pin Functions - Digital and Analog [ALP Package]
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Supply Specifications
    6. 6.6  Power Consumption Summary
    7. 6.7  RF Specification
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1  Antenna Radiation Patterns
        1. 6.10.1.1 Antenna Radiation Patterns for Receiver
        2. 6.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 6.10.2  Antenna Positions
      3. 6.10.3  Power Supply Sequencing and Reset Timing
      4. 6.10.4  Input Clocks and Oscillators
        1. 6.10.4.1 Clock Specifications
      5. 6.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 6.10.5.1 Peripheral Description
        2. 6.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 6.10.5.2.1 SPI Timing Conditions
          2. 6.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 6.10.5.3 SPI Peripheral Mode I/O Timings
          1. 6.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 6.10.5.4 Typical Interface Protocol Diagram (Slave Mode)
      6. 6.10.6  LVDS Interface Configuration
        1. 6.10.6.1 LVDS Interface Timings
      7. 6.10.7  General-Purpose Input/Output
        1. 6.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-45 #GUID-4685AB93-A014-47EA-9F05-952FFC28DBFA/T4362547-50
      8. 6.10.8  Controller Area Network Interface (DCAN)
        1. 6.10.8.1 Dynamic Characteristics for the DCANx TX and RX Pins
      9. 6.10.9  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 6.10.9.1 Dynamic Characteristics for the CANx TX and RX Pins
      10. 6.10.10 Serial Communication Interface (SCI)
        1. 6.10.10.1 SCI Timing Requirements
      11. 6.10.11 Inter-Integrated Circuit Interface (I2C)
        1. 6.10.11.1 I2C Timing Requirements #GUID-64613E7E-5DDF-4B01-8FA0-13739060F368/T4362547-185
      12. 6.10.12 Quad Serial Peripheral Interface (QSPI)
        1. 6.10.12.1 QSPI Timing Conditions
        2. 6.10.12.2 Timing Requirements for QSPI Input (Read) Timings #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-210 #GUID-6A95C194-2C40-46FE-9793-4574200DA2C4/T4362547-209
        3. 6.10.12.3 QSPI Switching Characteristics
      13. 6.10.13 ETM Trace Interface
        1. 6.10.13.1 ETMTRACE Timing Conditions
        2. 6.10.13.2 ETM TRACE Switching Characteristics
      14. 6.10.14 Data Modification Module (DMM)
        1. 6.10.14.1 DMM Timing Requirements
      15. 6.10.15 JTAG Interface
        1. 6.10.15.1 JTAG Timing Conditions
        2. 6.10.15.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 6.10.15.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Subsystems
      1. 7.3.1 RF and Analog Subsystem
        1. 7.3.1.1 Clock Subsystem
        2. 7.3.1.2 Transmit Subsystem
        3. 7.3.1.3 Receive Subsystem
      2. 7.3.2 Processor Subsystem
      3. 7.3.3 Automotive Interface
      4. 7.3.4 Main Subsystem Cortex-R4F Memory Map
      5. 7.3.5 DSP Subsystem Memory Map
    4. 7.4 Other Subsystems
      1. 7.4.1 ADC Channels (Service) for User Application
        1. 7.4.1.1 GP-ADC Parameter
  9. 8 Monitoring and Diagnostics
    1. 8.1 Monitoring and Diagnostic Mechanisms
      1. 8.1.1 Error Signaling Module
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALP|180
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Device Comparison

Table 4-1 shows a comparison between devices, highlighting the differences.

Table 4-1 Device Features Comparison
FUNCTION AWR6843AOP AWR1843AOP(1) AWR1843 AWR1642 AWR1443
Antenna on Package (AOP) Yes Yes — — —
Number of receivers 4 4 4 4 4
Number of transmitters 3(4) 3(4) 3(4) 2 3
RF frequency range 60 to 64 GHz 76 to 81 GHz 76 to 81 GHz 76 to 81 GHz 76 to 81 GHz
On-chip memory 1.75MB 2MB 2MB 1.5MB 576KB
Max I/F (Intermediate Frequency) (MHz) 10 10 10 5 5
Max real sampling rate (Msps) 25 25 25 12.5 12.5
Max complex sampling rate (Msps) 12.5 12.5 12.5 6.25 6.25
Device Security(2) Yes Yes Yes Yes —
Processors
MCU (Arm Cortex-R4F) Yes Yes Yes Yes Yes
DSP (C674x) Yes Yes Yes Yes —
Peripherals
Serial Peripheral Interface (SPI) ports 2 2 2 2 1
Quad Serial Peripheral Interface (QSPI) Yes Yes Yes Yes Yes
Inter-Integrated Circuit (I2C) interface 1 1 1 1 1
Controller Area Network (DCAN) interface — 1 1 1 1
Controller Area Network (CAN-FD) interface 2 1 1 1 —
Trace Yes Yes Yes Yes —
PWM Yes Yes Yes Yes —
Hardware In Loop (HIL/DMM) Yes Yes Yes Yes —
GPADC Yes Yes Yes Yes Yes
LVDS/Debug(3) Yes Yes Yes Yes Yes
Hardware accelerator Yes Yes Yes — Yes
1-V bypass mode Yes Yes Yes Yes Yes
JTAG Yes Yes Yes Yes Yes
Product status Product Preview (PP),
Advance Information (AI),
or Production Data (PD)		 PD(5) PD(5) PD(5) PD(5) PD(5)
(1) Developed for Functional Safety applications, the device supports hardware integrity upto ASIL-B. Refer to the related documentation for more details.
(2) Device security features including Secure Boot and Customer Programmable Keys are available in select devices for only select part variants as indicated by the Device Type identifier in Section 3, Device Information table.
(3) The LVDS interface is not a production interface and is only used for debug.
(4) 3 Tx Simultaneous operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply needs to be fed on the VOUT PA pin.
(5) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty.