ZHCSVF3P
December 1990 – March 2024
AM26C31
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics: AM26C31C and AM26C31I
5.6
Electrical Characteristics: AM26C31Q and AM26C31M
5.7
Switching Characteristics: AM26C31C and AM26C31I
5.8
Switching Characteristics: AM26C31Q and AM26C31M
5.9
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagrams
7.3
Feature Description
7.3.1
Active-High and Active-Low
7.3.2
Operates From a Single 5V Supply
7.4
Device Functional Modes
8
Application Information Disclaimer
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
接收文档更新通知
9.2
支持资源
9.3
Trademarks
9.4
静电放电警告
9.5
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
N|16
MPDI002C
PW|16
MPDS361A
DB|16
MPDS507A
D|16
MPDS178G
NS|16
MPDS551A
散热焊盘机械数据 (封装 | 引脚)
D|16
QFND167D
订购信息
zhcsvf3p_oa
zhcsvf3p_pm
9.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。