SLAS669E September   2010  – may 2020 ADS5400-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Interleaving Adjustments
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Configuration
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Analog Input Over-Range Recovery Error
      4. 7.3.4  Clock Inputs
      5. 7.3.5  Over Range
      6. 7.3.6  Data Scramble
      7. 7.3.7  Test Patterns
      8. 7.3.8  Die Identification and Revision
      9. 7.3.9  Die Temperature Sensor
      10. 7.3.10 Interleaving
        1. 7.3.10.1 Gain Adjustment
        2. 7.3.10.2 Offset Adjustment
        3. 7.3.10.3 Input Clock Coarse Phase Adjustment
        4. 7.3.10.4 Input Clock Fine Phase Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Bus and Clock Options
      2. 7.4.2 Reset and Synchronization
      3. 7.4.3 LVDS
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. Table 2. Instruction Byte of the Serial Interface
    6. 7.6 Serial Register Map
      1. 7.6.1 Description of Serial Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clocking Source for ADS5400-SP
        2. 8.2.2.2 Amplifier Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Definition of Specifications
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD5 to GND 6 V
AVDD3 to GND 5 V
DVDD3 to GND 5 V
AINP, AINN to GND(2) voltage difference between pin and ground 0.5 4.5 V
AINP to AINN (2) voltage difference between pins, common mode at AVDD5/2 short duration –0.3 (AVDD5 + 0.3) V
continuous AC signal 1.25 3.75 V
continuous DC signal 1.75 3.25 V
CLKINP, CLKINN to GND (2) voltage difference between pin and ground 0.5 4.5 V
CLKINP to CLKINN (2) voltage difference between pins, common mode at AVDD5/2 continuous AC signal 1.1 3.9 V
continuous DC signal 2 3 V
RESETP, RESETN to GND (2) voltage difference between pin and ground –0.3 (AVDD5 + 0.3) V
RESETP to RESETN (2) voltage difference between pins continuous AC signal 1.1 3.9 V
continuous DC signal 2 3 V
Data/OVR Outputs to GND (2) voltage difference between pin and ground –0.3 (DVDD3 + 0.3) V
SDENB, SDIO, SCLK to GND(2) –0.3 (AVDD3 + 0.3)
ENA1BUS, ENPWD, ENEXTREF to GND(2) –0.3 (AVDD5 + 0.3)
Operating case temperature range –55 125 °C
Maximum junction temperature, TJ 150 °C
Storage temperature range –65 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon request.
(2) Valid when supplies are within recommended operating range.