ZHCSMK4A september   2022  – july 2023 ADS131B26-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Offset Drift Measurement
    2. 8.2 Gain Drift Measurement
    3. 8.3 Noise Performance
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Naming Conventions
      2. 9.3.2 Precision Voltage References (REFA, REFB)
      3. 9.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 9.3.4 ADC1y
        1. 9.3.4.1 ADC1y Input Multiplexer
        2. 9.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 9.3.4.3 ADC1y ΔΣ Modulator
        4. 9.3.4.4 ADC1y Digital Filter
        5. 9.3.4.5 ADC1y Offset and Gain Calibration
        6. 9.3.4.6 ADC1y Conversion Data
      5. 9.3.5 ADC2y
        1. 9.3.5.1 ADC2y Input Multiplexer
        2. 9.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 9.3.5.3 ADC2y ΔΣ Modulator
        4. 9.3.5.4 ADC2y Digital Filter
        5. 9.3.5.5 ADC2y Offset and Gain Calibration
        6. 9.3.5.6 ADC2y Sequencer
        7. 9.3.5.7 VCMy Buffers
        8. 9.3.5.8 ADC2y Measurement Configurations
        9. 9.3.5.9 ADC2y Conversion Data
      6. 9.3.6 ADC3y
      7. 9.3.7 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 9.3.7.1 GPIOx PWM Output Configuration
        2. 9.3.7.2 GPIOx PWM Input Readback
      8. 9.3.8 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      9. 9.3.9 Monitors and Diagnostics
        1. 9.3.9.1  Supply Monitors
        2. 9.3.9.2  Clock Monitors
        3. 9.3.9.3  Digital Monitors
          1. 9.3.9.3.1 Register Map CRC
          2. 9.3.9.3.2 Memory Map CRC
          3. 9.3.9.3.3 GPIO Readback
        4. 9.3.9.4  Communication Monitors
        5. 9.3.9.5  Fault Flags and Fault Masking
        6. 9.3.9.6  FAULT Pin
        7. 9.3.9.7  Diagnostics and Diagnostic Procedure
        8. 9.3.9.8  Indicators
        9. 9.3.9.9  Conversion and Sequence Counters
        10. 9.3.9.10 Supply Voltage Readback
        11. 9.3.9.11 Temperature Sensors (TSA, TSB)
        12. 9.3.9.12 Test DACs (TDACA, TDACB)
        13. 9.3.9.13 Open-Wire Detection
        14. 9.3.9.14 Missing Host Detection and MHD Pin
        15. 9.3.9.15 Overcurrent Comparators (OCCA, OCCB)
          1. 9.3.9.15.1 OCCA and OCCB Pins
          2. 9.3.9.15.2 Overcurrent Indication Response Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset (POR)
        2. 9.4.1.2 RESETn Pin
        3. 9.4.1.3 RESET Command
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Active Mode
        2. 9.4.2.2 Standby Mode
        3. 9.4.2.3 Power-Down Mode
      3. 9.4.3 ADC Conversion Modes
        1. 9.4.3.1 ADC1y and ADC3y Conversion Modes
          1. 9.4.3.1.1 Continuous-Conversion Mode
          2. 9.4.3.1.2 Single-Shot Conversion Mode
          3. 9.4.3.1.3 Global-Chop Mode
            1. 9.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 9.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 9.4.3.2.1 Continuous Sequence Mode
          2. 9.4.3.2.2 Single-Shot Sequence Mode
          3. 9.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Serial Interface Signals
          1. 9.5.1.1.1 Chip Select (CSn)
          2. 9.5.1.1.2 Serial Data Clock (SCLK)
          3. 9.5.1.1.3 Serial Data Input (SDI)
          4. 9.5.1.1.4 Serial Data Output (SDO)
          5. 9.5.1.1.5 Data Ready (DRDYn)
        2. 9.5.1.2 Serial Interface Communication Structure
          1. 9.5.1.2.1 SPI Communication Frames
          2. 9.5.1.2.2 SPI Communication Words
          3. 9.5.1.2.3 STATUS Word
          4. 9.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 9.5.1.2.5 Commands
            1. 9.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 9.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 9.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 9.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 9.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 9.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 9.5.1.2.6 SCLK Counter
          7. 9.5.1.2.7 SPI Timeout
          8. 9.5.1.2.8 Reading ADC1A, ADC1B, ADC2A, ADC2B, ADC3A, and ADC3B Conversion Data
          9. 9.5.1.2.9 DRDYn Pin Behavior
    6. 9.6 Register Map
      1. 9.6.1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Minimum Interface Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Current Shunt Measurement
        2. 10.2.2.2 Battery Pack Voltage Measurement
        3. 10.2.2.3 Other Voltage Measurements
        4. 10.2.2.4 Shunt Temperature Measurement
        5. 10.2.2.5 Analog Output Temperature Sensor Measurement
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Supply Options
        1. 10.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 10.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 10.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 10.3.2 Power-Supply Sequencing
      3. 10.3.3 Power-Supply Decoupling
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PHP|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 说明（续）

ADS131B26-Q1 集成两个同步采样、高精度、24 位模数转换器 (ADC) 通道（ADC1A、ADC1B），可使用外部分流电阻器以高分辨率和高精度对电池电流进行冗余测量。两个独立的数字比较器可与两个 ADC 并联来实现快速过流检测。

此外，该器件还集成了一组（两个）同步采样 24 位 ADC（ADC3A、ADC3B），可使用外部高压电阻分压器同时测量电池包电压和电池电流，从而准确监测电池充电状态和运行状况。

另外还提供两个多路复用的 16 位 ADC 通道（ADC2A、ADC2B），可使用外部高压电阻分压器来测量分流器温度和系统中的其他电压，例如电池包电压。分流器温度通过热敏电阻或模拟输出温度传感器等外部温度传感器进行测量。每个 ADC 都配备一个通道序列发生器，后者会自动逐步调试配置的多路复用器输入，以减少 SPI 上的通信。

该器件集成了多种监测和诊断功能，可缓解和检测随机硬件故障，从而帮助开发功能安全 BMS。

输入范围高达 16V 的内部线性稳压器支持使用非稳压直流/直流转换器为器件供电。

ADS131B26-Q1 采用 48 引脚 HTQFP 封装，额定汽车级温度范围为 –40°C 至 +105°C。