ZHCSEA6B September   2015  – April 2016 ADS1257

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Serial Interface Timing Requirements
    7. 7.7  Serial Interface Switching Characteristics
    8. 7.8  RESET and SYNC/PWDN Timing Requirements
    9. 7.9  SCLK Reset Timing Requirements
    10. 7.10 DRDY Update Timing Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Input Multiplexer
      2. 9.3.2  Analog Input Buffer
      3. 9.3.3  Programmable Gain Amplifier (PGA)
      4. 9.3.4  Modulator Input Circuitry
      5. 9.3.5  Voltage Reference Inputs (REFP, REFN)
      6. 9.3.6  Clock Input (CLKIN)
      7. 9.3.7  Clock Output (D0/CLKOUT)
      8. 9.3.8  General-Purpose Digital I/O (D0, D1)
      9. 9.3.9  Open- and Short-Circuit Sensor Detection
      10. 9.3.10 Digital Filter
        1. 9.3.10.1 Frequency Response
        2. 9.3.10.2 50-Hz and 60-Hz, Line Cycle Rejection
        3. 9.3.10.3 Settling Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up
      2. 9.4.2 Reset
      3. 9.4.3 Standby Mode
      4. 9.4.4 Power-Down Mode
      5. 9.4.5 Conversion Control and Synchronization
        1. 9.4.5.1 Settling Time Using Synchronization
        2. 9.4.5.2 Settling Time Using Single-Shot Mode
        3. 9.4.5.3 Settling Time Using the Input Multiplexer
        4. 9.4.5.4 Settling Time while Continuously Converting
      6. 9.4.6 Calibration
        1. 9.4.6.1 Self-Calibration
          1. 9.4.6.1.1 SELFOCAL Command: Self-Offset Calibration
          2. 9.4.6.1.2 SELFGCAL Command: Self-Gain Calibration
          3. 9.4.6.1.3 SELFCAL Command: Self-Offset and Self-Gain Calibration
        2. 9.4.6.2 System Calibration
          1. 9.4.6.2.1 SYSOCAL Command: System-Offset Calibration
          2. 9.4.6.2.2 SYSGCAL Command: System-Gain Calibration
        3. 9.4.6.3 Auto-Calibration
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN) and Data Output (DOUT)
        4. 9.5.1.4 Data Ready (DRDY)
      2. 9.5.2 Data Format
      3. 9.5.3 Command Definitions
        1. 9.5.3.1  WAKEUP/NOP: Complete Synchronization or Exit Standby Mode
        2. 9.5.3.2  RDATA: Read Data
        3. 9.5.3.3  RDATAC: Read Data Continuous
        4. 9.5.3.4  SDATAC: Stop Read Data Continuous
        5. 9.5.3.5  RREG: Read from Registers
        6. 9.5.3.6  WREG: Write to Register
        7. 9.5.3.7  SELFCAL: Self-Offset and Self-Gain Calibration
        8. 9.5.3.8  SELFOCAL: Self Offset Calibration
        9. 9.5.3.9  SELFGCAL: Self Gain Calibration
        10. 9.5.3.10 SYSOCAL: System Offset Calibration
        11. 9.5.3.11 SYSGCAL: System Gain Calibration
        12. 9.5.3.12 STANDBY: Standby Mode / Single-shot Mode
        13. 9.5.3.13 RESET: Reset Registers to Default Values
        14. 9.5.3.14 SYNC: Synchronize the Analog-to-Digital Conversion
    6. 9.6 Register Map
      1. 9.6.1  STATUS: Status Register (address = 00h) [reset = x1h]
      2. 9.6.2  MUX : Input Multiplexer Control Register (address = 01h) [reset = 01h]
      3. 9.6.3  ADCON: ADC Control Register (address = 02h) [reset = 20h]
      4. 9.6.4  DRATE: ADC Data Rate Register (address = 03h) [reset = F0h]
      5. 9.6.5  IO: GPIO Control Register (address = 04h) [reset = E0h]
      6. 9.6.6  OFC0: Offset Calibration Register 0 (address = 05h) [reset = depends on calibration results]
      7. 9.6.7  OFC1: Offset Calibration Register 1 (address = 06h) [reset = depends on calibration results]
      8. 9.6.8  OFC2: Offset Calibration Register 2 (address = 07h) [reset = depends on calibration results]
      9. 9.6.9  FSC0: Full-Scale Calibration Register 0 (address = 08h) [reset = depends on calibration results]
      10. 9.6.10 FSC1: Full-Scale Calibration Register 1 (address = 09h) [reset = depends on calibration results]
      11. 9.6.11 FSC2: Full-Scale Calibration Register 2 (address = 0Ah) [reset = depends on calibration results]
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Basic Connections
      2. 10.1.2 Digital Interface Connections
      3. 10.1.3 Analog Input Filtering
      4. 10.1.4 External Reference
      5. 10.1.5 Isolated (or Floating) Sensor Inputs
      6. 10.1.6 Unused Inputs and Outputs
      7. 10.1.7 Pseudo Code Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Detailed Design Procedure for ±10-V Input
          1. 10.2.2.1.1 Absolute Input Voltage Range
          2. 10.2.2.1.2 Differential Input Voltage Range
          3. 10.2.2.1.3 Level-Shifted Resistor Divider Sizing
          4. 10.2.2.1.4 Input Filtering
          5. 10.2.2.1.5 Register Settings for ±10-V Input
          6. 10.2.2.1.6 Voltage Input Design Variations
        2. 10.2.2.2 Detailed Design Procedure for 4-mA to 20-mA Input
          1. 10.2.2.2.1 PGA Gain Selection
          2. 10.2.2.2.2 Current-Sense Resistor Sizing
          3. 10.2.2.2.3 Register Settings for 4-mA to 20-mA Input
          4. 10.2.2.2.4 Current Input Design Variations
      3. 10.2.3 Application Curves
    3. 10.3 Dos and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 文档支持

13.1.1 相关文档

Table 33 列出了相关文档和器件的快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，以及样片或购买的快速访问。

Table 33. 相关文档链接

器件 产品文件夹 样片与购买 技术文档 工具与软件 支持与社区
ADS1255 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
ADS1256 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
REF5025 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
OPA350 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
OPA188 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
MSP430F5529 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

13.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 商标

E2E is a trademark of Texas Instruments.

串行外设接口 (SPI), QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Instruments.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.