SBOA386B March   2020  – October 2023 INA180-Q1 , INA181-Q1 , INA185-Q1 , INA2180-Q1 , INA2181-Q1 , INA4180-Q1 , INA4181-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 INA180-Q1, SOT-23-5 Package
    2. 2.2 INA2180-Q1, VSSOP-8 Package
    3. 2.3 INA4180-Q1, TSSOP-14 Package
    4. 2.4 INA181-Q1, SOT-23-6 Package
    5. 2.5 INA2181-Q1, VSSOP-10 Package
    6. 2.6 INA4181-Q1, TSSOP-20 Package
    7. 2.7 INA181-Q1 and INA185-Q1, DCK Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 INA180-Q1, SOT-23-5 Package (Pinout A)
    2. 4.2 INA180-Q1, SOT-23-5 Package (Pinout B)
    3. 4.3 INA2180-Q1, VSSOP-8 Package
    4. 4.4 INA4180-Q1, TSSOP-14 Package
    5. 4.5 INA181-Q1, SOT-23-6 Package
    6. 4.6 INA2181-Q1, VSSOP-10 Package
    7. 4.7 INA4181-Q1, TSSOP-20 Package
    8. 4.8 INA181-Q1 and INA185-Q1, DCK Package
  7. 5Revision History

4.2 INA180-Q1, SOT-23-5 Package (Pinout B)

Figure 4-2 shows the INA180-Q1 pin diagram for the SOT-23-5 package (pinout B). For a detailed description of the device pins please refer to the 'Pin Configuration and Functions' section in the INA180-Q1 datasheet.


GUID-8A27B645-52C5-40C2-AFA2-9B002D7EBEDB-low.svg

Figure 4-2 INA180-Q1 Pin Diagram (SOT-23-5 Package, Pinout B)
Table 4-6 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
IN+1In high-side configuration, a short from the bus supply to GND will occur.B
GND2Normal operation.D
IN-3In high-side configuration, a short from the bus supply to GND will occur (through RSHUNT). High current will flow from bus supply to GND. The shunt may be damaged. In low-side configuration, normal operation.B for high-side; D for low-side
OUT4Output will be pulled down to GND and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating could cause die junction temperature to exceed 150°C.B
VS5Power supply shorted to GND.B
Table 4-7 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
IN+1Shunt resistor is not connected to amplifier. IN+ pin may float to an unknown value. Output will go to an unknown value not to exceed VS or GND.B
GND2When GND is floating, output will be incorrect as it is no longer referenced to GND.B
IN-3Shunt resistor is not connected to amplifier. IN- pin may float to an unknown value. Output will go to an unknown value not to exceed VS or GND.B
OUT4Output can be left open. There is no effect on the IC, but the output will not be measured.C
VS5No power to device. Device may be biased through inputs. Output will be incorrect and close to GND.B
Table 4-8 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 2 - GND In high-side configuration, a short from the bus supply to GND will occur. B
GND 2 3 - IN- In high-side configuration, a short from the bus supply to GND will occur (through RSHUNT). High current will flow from bus supply to GND. The shunt may be damaged. In low-side configuration, normal operation. B for high-side; D for low-side
IN- 3 4 - OUT In high-side configuration, OUT pin shorted to bus supply. In low side configuration, output is shorted to GND. A for high-side; B for low-side
OUT 4 5 - VS Output will be pulled to VS and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating could cause die junction temperature to exceed 150°C. B
VS 5 1 - IN+ In high-side configuration, device power supply shorted to bus supply. In low-side configuration, device power supply shorted to GND (through RSHUNT). A for high-side; B for low-side
Table 4-9 Pin FMA for Device Pins Short-Circuited to VS
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
IN+1In high-side configuration, device power supply shorted to bus supply. In low-side configuration, device power supply shorted to GND (through RSHUNT).A for high-side; B for low-side
GND2Power supply shorted to GND.B
IN-3In high-side configuration, device power supply shorted to bus supply (through RSHUNT). In low-side configuration, device power supply shorted to GND.A for high-side; B for low-side
OUT4Output will be pulled to VS and output current will be short circuit limited. When left in this configuration for a long time, under high supplies self-heating could cause die junction temperature to exceed 150°C.B
VS5Normal operation.D