ZHCSIS2B september   2018  – december 2020 TPS7A11

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
        1. 7.3.1.1 Global Undervoltage Lockout (UVLO)
      2. 7.3.2 Active Discharge
      3. 7.3.3 Enable Pin
      4. 7.3.4 Sequencing Requirement
      5. 7.3.5 Internal Foldback Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
      8. 8.1.8 Estimating Junction Temperature
      9. 8.1.9 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Spice Model
      3. 11.1.3 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13.   Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 超低输入电压范围：0.75 V 至 3.3 V
  • 可实现超低功率损耗的超低压降：
    • 采用 500mA DRV 封装时为 140mV（最大值）
    • 采用 500mA YKA 封装时为 110mV（最大值）
  • 低静态电流：
    • VIN IQ = 1.6µA（典型值）
    • VBIAS IQ = 6µA（典型值）
  • 负载、线路和温度范围内的精度为 1.5%
  • 高 PSRR：1 kHz 时为 64 dB
  • 可提供固定输出电压：
    • 0.5V 至 3.0V（阶跃为 50mV）
  • VBIAS 范围：1.7V 至 5.5V
  • 封装：
    • 2.0mm × 2.0mm WSON (6)
    • 0.74mm × 1.09mm DSBGA (5)
  • 有源输出放电