ZHCSKR9A January   2020  – March 2020 TPS59603-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化应用
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 UVLO Protection
      2. 7.3.2 PWM Pin
      3. 7.3.3 SKIP Pin
        1. 7.3.3.1 Zero Crossing (ZX) Operation
      4. 7.3.4 Adaptive Dead-Time Control and Shoot-Through Protection
      5. 7.3.5 Integrated Boost-Switch
    4. 7.4 Device Functional Modes
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Recommendation
  10. 10器件和文档支持
    1. 10.1 器件支持
      1. 10.1.1 开发支持
    2. 10.2 文档支持
      1. 10.2.1 相关文档
    3. 10.3 社区资源
    4. 10.4 商标
    5. 10.5 静电放电警告
    6. 10.6 Glossary
  11. 11机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Recommendation

Figure 17 above shows the primary current loops in each phase, numbered in order of importance.

The most important loop to minimize the area of is loop 1, the path from the input capacitor through the high and low-side FETs, and back to the capacitor through ground.

Loop 2 is from the inductor through the output capacitor, ground, and Q2. The layout of the low-side gate drive (Loops 3a and 3b) is important. The guidelines for the gate drive layout are:

  • Make the low-side gate drive length as short as possible (1 inch or less preferred).
  • Make the DRVL width to length ratio of 1:10, wider (1:5) if possible.
  • If changing layers is necessary, use at least two vias.
TPS59603-Q1 v12191_lusb32.gifFigure 17. Layout recommendations to minimize major Current loops