SLAS354C September   2001  – September 2015 TLV2553

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  External Reference Specifications
    7. 6.7  Operating Characteristics
    8. 6.8  Timing Requirements: VREF+ = 5 V
    9. 6.9  Timing Requirements: VREF+ = 2.5 V
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog MUX
      2. 8.3.2 Reference
    4. 8.4 Device Functional Modes
      1. 8.4.1  Converter Operation
      2. 8.4.2  Data I/O Cycle
      3. 8.4.3  Sampling Cycle
      4. 8.4.4  Conversion Cycle
      5. 8.4.5  Power Up and Initialization
        1. 8.4.5.1 Example
      6. 8.4.6  Data Input
      7. 8.4.7  Data Input—Address/Command Bits
      8. 8.4.8  Data Output Length
      9. 8.4.9  LSB Out First
      10. 8.4.10 Bipolar Output Format
      11. 8.4.11 EOC Output
      12. 8.4.12 Chip-Select Input (CS)
      13. 8.4.13 Power-Down Features
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.