ZHCSRU6F May   2002  – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD06 , SN75HVD07

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1.      Parameter Measurement Information
  6. 6 Function Tables
    1. 6.1 Receiver Failsafe
  7. 7 Equivalent Input and Output Schematic Diagrams
  8. 8 Application and Implementation
    1.     Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Package Dissipation Ratings

(See Figure 5-1 and Figure 5-2)
PACKAGE TA ≤ 25°C
POWER RATING		 DERATING FACTOR(1) ABOVE TA = 25°C TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
D(2)  710 mW  5.7 mW/°C 455 mW 369 mW
D(3)  1282 mW  10.3 mW/°C 821 mW 667 mW
P 1000 mW  8.0 m W/°C 640 mW 520 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) Tested in accordance with the Low-K thermal metric definitions of EIA/JESD51-3
(3) Tested in accordance with the High-K thermal metric definitions of EIA/JESD51-7