ZHCSRU6F May   2002  – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD06 , SN75HVD07

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1.      Parameter Measurement Information
  6. 6 Function Tables
    1. 6.1 Receiver Failsafe
  7. 7 Equivalent Input and Output Schematic Diagrams
  8. 8 Application and Implementation
    1.     Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC(1) D (SOIC)

SN65 Variation

D (SOIC) SN75 Variation

 P (PDIP) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 175.4 125 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.3 53.6 34.9 °C/W
RθJB Junction-to-board thermal resistance 63.4 45.1 23.7 °C/W
ψJT Junction-to-top characterization parameter 8.8 10.1 12.1 °C/W
ψJB Junction-to-board characterization parameter 62.6 44.4 23.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.