ZHCSCZ5E December   2013  – January 2022 LMK00334

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements, Propagation Delay, and Output Skew
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Crystal Power Dissipation vs. RLIM
      2. 8.3.2 Clock Inputs
      3. 8.3.3 Clock Outputs
        1. 8.3.3.1 Reference Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC and VCCO Power Supplies
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Driving the Clock Inputs
        2. 9.2.1.2 Crystal Interface
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Termination and Use of Clock Drivers
        2. 9.2.2.2 Termination for DC-Coupled Differential Operation
        3. 9.2.2.3 Termination for AC-Coupled Differential Operation
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Current Consumption and Power Dissipation Calculations
      1. 10.1.1 Power Dissipation Example: Worst-Case Dissipation
    2. 10.2 Power Supply Bypassing
      1. 10.2.1 Power Supply Ripple Rejection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Management
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (July 2021) to Revision E (January 2022)

  • 更改了数据表标题Go
  • 添加了指向应用 部分的链接Go
  • 向说明 部分添加了文本Go
  • Added example board layout to Packaging Information section.Go

Changes from Revision C (July 2017) to Revision D (July 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 在数据表中添加了 PCIe 第 5.0 代Go
  • Corrected PN in Figure 9-4 and Figure 9-5 to LMK00334.Go

Changes from Revision B (May 2017) to Revision C (July 2017)

  • Added PCIe 4.0 compliance dataGo

Changes from Revision A (October 2014) to Revision B (May 2017)

  • 已将整个数据表中的 CLKout_EN 引脚更改为 CLKout_EN Go
  • Add pins 28 and 32 to the Pin Functions table Go
  • Moved the storage temperature to the Absolute Maximum Ratings tableGo
  • Added test conditions to the output supply voltage parameter in the Recommended Operating Conditions tableGo

Changes from Revision * (December 2013) to Revision A (October 2014)

  • 添加、更新或重命名了以下各个部分：器件信息表、应用和实施；电源建议；布局；器件和文档支持；机械、封装和可订购信息 Go
  • Changed from 1 MHz to 12 kHz in Electrical Characteristics Go
  • Deleted "The additive jitter The additive RMS jitter was approximated ... "Go