ZHCSUM4D November   1994  – February 2024 LMC6032 , LMC6034

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC6032
    5. 5.5 Thermal Information LMC6034
    6. 5.6 Electrical Characteristics
    7.     Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Bias Current Testing
    2. 6.2 Typical Applications
      1.      Typical Single-Supply Applications
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout for High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3.     Trademarks
    4. 7.3 静电放电警告
    5. 7.4 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply voltage V
Supply voltage, VS = (V+) – (V–) Single supply 0 16 V
Dual supply ±8
Output short circuit To V+ See(2) mA
To V– See(3)
Signal input pins Voltage (V–) – 0.3 (V+) + 0.3 V
Current ±5 mA
Output pin current ±18 mA
Power supply pin Current 35 mA
Power dissipation See(4)
Temperature Operating, TA –40 150 °C
Junction, TJ 150
Storage, Tstg –65 150
Lead (soldering, 10 sec.) 260
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Do not connect output to V+, when V+ is greater than 13V or reliability will be adversely affected.
(4) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) – TA) / θJA