ZHCSUM4D November   1994  – February 2024 LMC6032 , LMC6034

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC6032
    5. 5.5 Thermal Information LMC6034
    6. 5.6 Electrical Characteristics
    7.     Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Bias Current Testing
    2. 6.2 Typical Applications
      1.      Typical Single-Supply Applications
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout for High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3.     Trademarks
    4. 7.3 静电放电警告
    5. 7.4 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Printed Circuit Board Layout for High-Impedance Work

Generally, any circuit that operates with less than 1000pA of leakage current requires special layout of the printed circuit board (PCB). To take advantage of the ultra-low bias current of the LMC603x, typically less than 40fA, an excellent layout is essential. Fortunately, the techniques for obtaining low leakages are quite simple. Foremost, do not ignore the surface leakage of the PCB, even though the leakage can sometimes appear acceptably low, because under conditions of high humidity or dust or contamination, the surface leakage can be appreciable.

To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LMC603x inputs and the terminals of capacitors, diodes, conductors, resistors, relay terminals, and so on, connected to the op amp inputs. See Figure 6-16. To have a significant effect, place guard rings on both the top and bottom of the PCB. This PCB foil must then be connected to a voltage which is at the same voltage as the amplifier inputs, since no leakage current can flow between two points at the same potential. For example, a PCB trace-to-pad resistance of 1012Ω, which is normally considered a very large resistance, can leak 5pA if the trace were a 5V bus adjacent to the pad of an input. This causes a 100 times degradation from the LMC603x actual performance. However, if a guard ring is held within 5mV of the inputs, then even a resistance of 1011Ω causes only 50fA of leakage current, or perhaps a minor (2:1) degradation of the amplifier performance. See Figure 6-17, Figure 6-18, Figure 6-19 for typical connections of guard rings for standard op amp configurations. If both inputs are active and at high impedance, the guard can be tied to ground and still provide some protection; see Figure 6-20.

GUID-24C5B3C1-AE0D-4DAE-BA75-9DEE1353298B-low.png Figure 6-16 Example of Guard Ring in PCB Layout
GUID-73D3A589-8C90-4BB8-95D0-7913A8F2D75C-low.pngFigure 6-17 Inverting Amplifier Guard-Ring Connections
GUID-4228AF5A-E17F-4455-A7D9-E3CA4145EC9B-low.pngFigure 6-18 Noninverting Amplifier Guard-Ring Connections
GUID-222AB254-610C-40FB-84AE-5D5E6B077DB9-low.pngFigure 6-19 Follower Guard-Ring Connections
GUID-4F10637A-3004-490D-8A5E-36F6863C88B0-low.pngFigure 6-20 Howland Current-Pump Guard-Ring Connections

Be aware that when laying out a PCB for the sake of just a few circuits is inappropriate, there is another technique which is even better than a guard ring on a PCB. Do not insert the amplifier input pin into the board at all, but bend the pin up in the air and use only air as an insulator. Air is an excellent insulator. In this case you forgo some of the advantages of PCB construction, but the advantages of air are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 6-21.

GUID-F4D15414-5EE0-40D0-8F03-571315FF8A5A-low.png
Input pins are lifted out of PCB and soldered directly to components. All other pins connected to the PCB.
Figure 6-21 Air Wiring