ZHCSGI4B August   2017  – February 2022 CSD22205L

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 CSD22205L Package Dimensions
    2. 7.2 Land Pattern Recommendation
    3. 7.3 Stencil Recommendation

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YMG|4
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision A (August 2017) to Revision B (February 2022)

  • 将超薄型封装要点中的厚度从 0.35mm 更改为 0.36mmGo
  • Changed CSD22205L Package Dimensions image height from 0.35 mm to 0.36 mm.Go

Changes from Revision * (May 2017) to Revision A (August 2017)

  • Changed the units for timing parameters from µs : to ns (nanoseconds) in the Section 5.1 tableGo