ZHCSCX4A June   2014  – October 2014 ADS8339

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Family
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Parametric Measurement Information
    1. 8.1 Timing Diagrams
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Power Saving
      3. 9.3.3 Digital Output
      4. 9.3.4 SCLK Input
    4. 9.4 Device Functional Modes
      1. 9.4.1 CS Mode for a 3-Wire Interface
        1. 9.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 9.4.1.2 3-Wire CS Mode With a Busy Indicator
      2. 9.4.2 CS Mode for a 4-Wire Interface
        1. 9.4.2.1 4-Wire CS Mode Without a Busy Indicator
        2. 9.4.2.2 4-Wire CS Mode With a Busy Indicator
      3. 9.4.3 Daisy-Chain Mode
        1. 9.4.3.1 Daisy-Chain Mode Without a Busy Indicator
        2. 9.4.3.2 Daisy-Chain Mode With a Busy Indicator
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
        1. 10.1.1.1 Reference Driver Circuit
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 Antialiasing Filter
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Do's and Don'ts
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档 
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Layout

12.1 Layout Guidelines

Figure 64 shows one of the board layouts as an example when using ADS8339 in a circuit.

  • A printed circuit board (PCB) board with at least four layers is recommended to keep all critical components on the top layer.
  • Analog input signals and the reference input signals must be kept away from noise sources. Crossing digital lines with the analog signal path should be avoided. The analog input and the reference signals are routed on to the left side of the board and the digital connections are routed on the right side of the device.
  • Due to the dynamic currents that occur during conversion and data transfer, each supply pin (AVDD and DVDD) must have a decoupling capacitor that keeps the supply voltage stable. TI recommends using one 1-μF ceramic capacitor at each supply pin.
  • A layout that interconnects the converter and accompanying capacitors with the low inductance path is critical for achieving optimal performance. Using 15-mil vias to interconnect components to a solid analog ground plane at the subsequent inner layer minimizes stray inductance. Avoid placing vias between the supply pin and the decoupling capacitor. Any inductance between the supply capacitor and the supply pin of the converter must be kept to less than 5 nH by placing the capacitor within 0.2 inches from the supply or input pins of the ADS8339 and by using 20-mil traces, as shown in Figure 64.
  • Dynamic currents are also present at the REFIN pin during the conversion phase. Therefore, good decoupling is critical to achieve optimal performance. The inductance between the reference capacitor and the REFIN pin must be kept to less than 2 nH by placing the capacitor within 0.1 inches from the REFIN pin and by using 20-mil traces.
  • A single 10-μF, X7R-grade, 0805-size ceramic capacitor with at least a 10-V rating is recommended for good performance over temperature range.
  • A small, 0.1-Ω to 0.47-Ω, 0603-size resistor placed in series with the reference capacitor keeps the overall impedance low and constant, especially at very high frequencies.
  • Avoid using additional lower value capacitors because the interactions between multiple capacitors can affect the ADC performance at higher sampling rates.
  • Place the RC filters immediately next to the input pins. Among surface-mount capacitors, COG (NPO) ceramic capacitors provide the best capacitance precision. The type of dielectric used in COG (NPO) ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes.

12.2 Layout Example

ADS8339_layout_bas677.gifFigure 64. Board Layout Example