ZHCSAM3B December   2012  – April 2022 ADS54T01

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Electrical Characteristics
    7. 7.7  Electrical Characteristics
    8. 7.8  Electrical Characteristics
    9. 7.9  Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Test Pattern Output
      2. 8.3.2  Clock Inputs
      3. 8.3.3  SNR and Clock Jitter
      4. 8.3.4  Analog Inputs
      5. 8.3.5  Over-Range Indication
      6. 8.3.6  Interleaving Correction
      7. 8.3.7  High-Resolution Output Data
      8. 8.3.8  Low-Resolution Output Data
      9. 8.3.9  Full Speed – 7 Bit
      10. 8.3.10 Decimated Low-Resolution Output Data
      11. 8.3.11 Multi Device Synchronization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
      2. 8.4.2 Feedback Mode: Burst Mode
      3. 8.4.3 Receive Mode: Decimation Filter
      4. 8.4.4 Manual Trigger Mode
      5. 8.4.5 Auto Trigger Mode
    5. 8.5 Programming
      1. 8.5.1 Device Initialization
      2. 8.5.2 Serial Register Write
      3. 8.5.3 Serial Register Readout
    6. 8.6 Register Maps
      1. 8.6.1 Serial Register Map
      2. 8.6.2 Description of Serial Interface Registers
  9. 9 Power Supply Recommendations
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

7.4 Thermal Information

THERMAL METRIC(1) ADS54T01 UNIT
ZAY (NFBGA)
196 PINS
θJA Junction-to-ambient thermal resistance(2) 37.6 °C/W
θJCtop Junction-to-case (top) thermal resistance(3) 6.8 °C/W
θJB Junction-to-board thermal resistance(4) 16.8 °C/W
ψJT Junction-to-top characterization parameter(5) 0.2 °C/W
ψJB Junction-to-board characterization parameter(6) 16.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).