
TMDS64GPEVM 是一款原型评估模块,限量出售。
我们建议新用户选择 TMDS64EVM 用于评估。该评估模块是全新的一代产品,包含可为安全应用定制密钥和加密的高安全性 - 现场安全 (HS-FS) 芯片。
TMDS64 评估模块 (EVM) 是一个独立的测试和开发平台,用于评估 AM64x 系列产品的功能并开发适用于各种应用的原型。
TMDS64GPEVM 配备了 Sitara™ AM6442 处理器以及其他元件,使用户可以利用各种器件接口,包括工业以太网、标准以太网、外设组件快速互连 (PCIe)、快速串行接口 (FSI) 等,从而轻松创建原型。
板载显示器利用 AM64x 的串行外设接口 (SPI) 端口,除了提供 LED 之外,还提供本地视觉输出。板载电流测量功能可为功耗敏感型应用监测功耗。
随附的 USB 电缆与嵌入式仿真逻辑配套,可以使用标准开发工具(例如 Code Composer Studio™ 集成开发环境 [IDE] [CCSTUDIO])进行仿真和调试。
TMDS64GPEVM 是一款原型评估模块,限量出售。
我们建议新用户选择 TMDS64EVM 用于评估。该评估模块是全新的一代产品,包含可为安全应用定制密钥和加密的高安全性 - 现场安全 (HS-FS) 芯片。
类型 | 标题 | 下载最新的英文版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 更多文献资料 | AM64x EVM box insert (Rev. A) | 2022年 8月 25日 | |||
* | 用户指南 | AM64x General Purpose EVM Quick Start Guide | 2021年 7月 23日 | |||
证书 | TMDS64GPEVM EU RoHS Declaration of Conformity (DoC) (Rev. A) | 2022年 8月 11日 | ||||
应用手册 | Sitara™AM64x/AM243x 基准测试 (Rev. A) | PDF | HTML | 下载英文版本 (Rev.A) | PDF | HTML | 2022年 8月 1日 | |
应用手册 | AM64x/AM243x DDR 电路板设计和布局指南 (Rev. A) | PDF | HTML | 下载英文版本 (Rev.A) | PDF | HTML | 2022年 5月 26日 | |
用户指南 | AM64x/AM243x GP EVM 用户指南 (Rev. D) | PDF | HTML | 下载英文版本 (Rev.D) | PDF | HTML | 2022年 2月 24日 |
Processor SDK LINUX AM64X - Linux Installer for sources, pre-built binaries and file system images generated using Yocto build environment
Processor SDK LINUX AM64X - SD card image
Get access to latest bug fixes and feature enhancements with Yocto build environment
Quick Start Guide for the AM64X evaluation module board
Quick Start Guide for the AM64X starter kit board
Processor SDK LINUX AM64X - Online SDK user manual for developers
Instructions to build Linux image for AM64x using Yocto build environment
Processor SDK LINUX AM64X - Instructions for creating an SD card
Learn how to build embedded Linux systems using AM64x processors
Processor SDK LINUX AM64X - Download SDK user manual for offline view
Processor SDK LINUX AM64X - Software manifest
Thank you for your interest in PROCESSOR SDK LINUX AM64X Software Development Kit (SDK). This SDK is a Linux only package. The Processor SDK is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices.
This release adds support for production Silicon Release 2.0 High Security - Field Securable (HS-FS) devices. For more information, please see the Migration Guide.
TI Linux CI/CD Snapshot
In order to improve access to the very latest bug fixes and feature enhancements, TI is enabling Continuous Integration and Continuous Deployment (CI/CD) for AM64x processors. The patches for these changes have always been available on public repositories hosted on git.ti.com, and these source repositories could be built using the Yocto build environment on a daily basis. The new TI Linux CI/CD Snapshot makes it even easier to consume these changes with pre-built binaries of Linux boot images to try out on TI Evaluation Modules (EVMs and SKs) before migrating or picking the patches. A detailed test report is also published to help users understand the status of the build and features being validated. The Linux boot images from a snapshot can be regenerated using sources by following the build instructions provided on the snapshot page.
The daily snapshot is not a replacement for the official Processors SDK releases which have full documentation, training and support. The snapshot is a new easy way to try bug fixes and feature enhancements planned for the next SDK while enabling much more tighter integration with customizations and application development. This improved integration should allow users to release their customized code built on the SDKs more quickly and confidently.