TLV4825
- Ultra-low offset drift: ±0.02µV/°C
- Flat low frequency noise: 0.3µVPP (0.1 to 10Hz)
- Ultra-low offset: ±4µV
- Rail-to-rail input and output
- Very high AOL, CMRR, PSRR: > 120dB
- Wide input common-mode: 100mV beyond rails
- Low input bias current: ±100pA
- Low thermal noise floor: 15nV/√Hz
- Wide gain bandwidth: 3.5MHz
- High CL drive: 1nF (no sustained oscillations)
- Low quiescent current: 500µA/channel
- Wide supply range: 1.8V to 5.5V
- Wide temperature range: –40°C to +125°C
The TLVx825 family of single, dual, and quad channel operational amplifiers enable precision performance such as lower offset, lower offset drift over temperature, greater offset stability over time and a flat noise floor. This level of performance is crucial to a variety of systems focusing on precision voltage sensing from sensors and precision current sensing using smaller shunt resistors.
TLVx825 uses zero-drift architecture to achieve an input referred offset voltage of 4µV, an offset drift of 0.02µV/°C and a low frequency noise of 320nVPP in the standard 0.1 – 10Hz range. This combination of specs provides excellent accuracy in high gain applications, thereby greatly reducing the need for system level calibration.
Additionally, with a quiescent current of 500µA, the TLVx825 is able to achieve a bandwidth of 3.5MHz and a broadband noise of 15nV/√Hz. This ability is crucial to achieve higher linearity, and signal-to-noise ratio in applications involving higher resolution, mid-speed analog to digital converters (ADCs) while minimizing system power.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TLVx825 3.5MHz, 1.8V to 5.5V, High Precision, Zero-Drift Operational Amplifiers 数据表 (Rev. B) | PDF | HTML | 2026-9-22 | ||
| 技术文章 | 为每一款设计实现精密放大器性能 | PDF | HTML | PDF | HTML | 2026-8-20 |
设计与开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:
- D(SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 和 SOT23-6)
- DCK(SC70-5 和 SC70-6)
TLV825, TLV2825 and TLV4825 TINA-TI SPICE Model (Rev. A)
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| TSSOP (PW) | 14 | Ultra Librarian |
| SOIC (D) | 14 | Ultra Librarian |
订购和质量
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。