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通用运算放大器

TLV2470

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具有关断功能的单路、6V、2.8MHz、RRIO 运算放大器

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OPA310 正在供货 单通道、5.5V、3MHz 高输出电流 (150mA) 快速关断 (1μs) 运算放大器 Higher GBW (3MHz), better accuracy (1.4mV Vos max), higher output current (150mA)

TLV2470

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产品详情

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 2.8 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 2.2 Iq per channel (typ) (mA) 0.6 Vn at 1 kHz (typ) (nV√Hz) 15 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 0.4 Features Shutdown Input bias current (max) (pA) 50 CMRR (typ) (dB) 84 Iout (typ) (A) 0.09 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.07 Output swing headroom (to positive supply) (typ) (V) -0.04
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 2.8 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 2.2 Iq per channel (typ) (mA) 0.6 Vn at 1 kHz (typ) (nV√Hz) 15 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 0.4 Features Shutdown Input bias current (max) (pA) 50 CMRR (typ) (dB) 84 Iout (typ) (A) 0.09 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.07 Output swing headroom (to positive supply) (typ) (V) -0.04
SOT-23 (DBV) 6 8.12 mm² (2.9 mm × 2.8 mm) PDIP (P) 8 92.5083 mm² (9.81 mm × 9.43 mm) SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm)
  • CMOS Rail-To-Rail Input/Output
  • Input Bias Current: 2.5pA
  • Low Supply Current: 600µA/Channel
  • Ultra-Low Power Shutdown Mode:
    • IDD(SHDN): 350nA/ch at 3V
    • IDD(SHDN): 1000nA/ch at 5V
  • Gain-Bandwidth Product: 2.8MHz
  • High Output Drive Capability:
    • ±10mA at 180mV
    • ±35mA at 500mV
  • Input Offset Voltage: 250µV (typ)
  • Supply Voltage Range: 2.7V to 6V
  • Ultra-Small Packaging
    • SOT23-5 or -6 (TLV2470/1)
    • MSOP-8 or -10 (TLV2472/3)

PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
  • CMOS Rail-To-Rail Input/Output
  • Input Bias Current: 2.5pA
  • Low Supply Current: 600µA/Channel
  • Ultra-Low Power Shutdown Mode:
    • IDD(SHDN): 350nA/ch at 3V
    • IDD(SHDN): 1000nA/ch at 5V
  • Gain-Bandwidth Product: 2.8MHz
  • High Output Drive Capability:
    • ±10mA at 180mV
    • ±35mA at 500mV
  • Input Offset Voltage: 250µV (typ)
  • Supply Voltage Range: 2.7V to 6V
  • Ultra-Small Packaging
    • SOT23-5 or -6 (TLV2470/1)
    • MSOP-8 or -10 (TLV2472/3)

PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.

The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.

The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
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技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown 数据表 (Rev. E) 2007-7-3
应用手册 使用 TI 运算放大器调节开关模式电源电流信号 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2021-7-16
电子书 The Signal e-book: 有关运算放大器设计主题的博客文章汇编 PDF | HTML 英语版 PDF | HTML 2018-1-31
应用手册 Use of Rail-to-Rail Operational Amplifiers (Rev. A) 1999-12-22

设计与开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

评估板

AMP-PDK-EVM — 放大器高性能开发套件评估模块

放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件，与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板，主板上具有多个插槽式子卡选项以满足封装需求，使工程师能够快速评估和验证器件性能。

AMP-PDK-EVM 套件支持五种常用的业界通用封装，包括：

  • D（SOIC-8 和 SOIC-14）
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV（SOT23-5 和 SOT23-6）
  • DCK（SC70-5 和 SC70-6）
用户指南: PDF | HTML
支持的产品和硬件
评估板

DIP-ADAPTER-EVM — DIP 适配器评估模块

借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试，该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器，或者将这些端子板直接连接至现有电路。

DIP-Adapter-EVM 套件支持六种常用的业界通用封装，包括：

  • D 和 U (SOIC-8)
  • PW (TSSOP-8)
  • DGK（MSOP-8、VSSOP-8）
  • DBV（SOT23-6、SOT23-5 和 SOT23-3）
  • DCK（SC70-6 和 SC70-5）
  • DRL (SOT563-6)
支持的产品和硬件
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封装 引脚 CAD 符号、封装和 3D 模型
SOT-23 (DBV) 6 Ultra Librarian
PDIP (P) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
适用于评估类项目的 TI 标准条款与条件。

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