OMAP3515

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Sitara 处理器：Arm Cortex-A8、3D 图形、LPDDR

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数据表

document-pdfAcrobat OMAP3515 and OMAP3503 Applications Processors 数据表 (Rev. H) (英语)

OMAP3515

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数据表

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CPU

1 Arm Cortex-A8

Frequency (MHz)

720

Graphics acceleration

1 3D

Display type

1 LCD

Operating system

Linux, RTOS

Security

Cryptographic acceleration

Rating

Catalog

Power supply solution

TPS65921, TPS65950

Operating temperature range (°C)

-40 to 105

CPU

1 Arm Cortex-A8

Frequency (MHz)

720

Graphics acceleration

1 3D

Display type

1 LCD

Operating system

Linux, RTOS

Security

Cryptographic acceleration

Rating

Catalog

Power supply solution

TPS65921, TPS65950

Operating temperature range (°C)

-40 to 105

FCCSP (CBB)

515

144 mm² (12 mm × 12 mm)

FCCSP (CUS)

423

256 mm² (16 mm × 16 mm)

OMAP3 Devices:
- OMAP™ 3 Architecture
- MPU Subsystem
  - Up to 720-MHz ARM® Cortex™-A8 Core
  - NEON™ SIMD Coprocessor
- PowerVR® SGX™ Graphics Accelerator
  - Tile-Based Architecture Delivering up to 1 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine-Grained Task Switching, Load Balancing, and Power Management
  - Programmable High-Quality Image Anti-Aliasing
- Fully Software-Compatible with ARM9™
- Commercial and Extended Temperature Grades
ARM Cortex-A8 Core
- ARMv7 Architecture
  - TrustZone®
  - Thumb®-2
  - MMU Enhancements
- In-Order, Dual-Issue, Superscalar Microprocessor Core
- NEON Multimedia Architecture
- Over 2x Performance of ARMv6 SIMD
- Supports Both Integer and Floating-Point SIMD
- Jazelle® RCT Execution Environment Architecture
- Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
- Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
ARM Cortex-A8 Memory Architecture:
- -KB Instruction Cache (4-Way Set-Associative)
- -KB Data Cache (4-Way Set-Associative)
- -KB L2 Cache
112KB of ROM
64KB of Shared SRAM
Endianess:
- ARM Instructions – Little Endian
- ARM Data – Configurable
External Memory Interfaces:
- General Purpose Memory Controller (GPMC)
  - 16-Bit-Wide Multiplexed Address and Data Bus
  - Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
  - Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
  - Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
  - Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
Camera Image Signal Processor (ISP)
- CCD and CMOS Imager Interface
- Memory Data Input
- BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
- Glueless Interface to Common Video Decoders
- Resize Engine
  - Resize Images From 1/4x to 4x
  - Separate Horizontal and Vertical Control
Display Subsystem
- Parallel Digital Output
  - Up to 24-Bit RGB
  - HD Maximum Resolution
  - Supports Up to 2 LCD Panels
  - Support for Remote Frame Buffer Interface (RFBI) LCD Panels
- 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
  - Composite NTSC and PAL Video
  - Luma and Chroma Separate Video (S-Video)
- Rotation 90-, 180-, and 270-Degrees
- Resize Images From 1/4x to 8x
- Color Space Converter
- 8-Bit Alpha Blending
Serial Communication
- 5 Multichannel Buffered Serial Ports (McBSPs)
  - 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
  - 5-KB Transmit and Receive Buffer (McBSP2)
  - SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
  - Direct Interface to I2S and PCM Device and TDM Buses
  - 128-Channel Transmit and Receive Mode
- Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
- High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
- High-, Full-, and Low-Speed Multiport USB Host Subsystem
  - 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
- One HDQ™/1-Wire® Interface
- UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
- Three Master and Slave High-Speed Inter-Integrated Circuit (I²C) Controllers
Removable Media Interfaces:
- Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
Comprehensive Power, Reset, and Clock Management
- SmartReflex™ Technology
- Dynamic Voltage and Frequency Scaling (DVFS)
Test Interfaces
- IEEE 1149.1 (JTAG) Boundary-Scan Compatible
- ETM Interface
- Serial Data Transport Interface (SDTI)
12 32-Bit General-Purpose Timers
2 32-Bit Watchdog Timers
1 32-Bit 32-kHz Sync Timer
Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
5-nm CMOS Technologies
Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
Discrete Memory Interface
Packages:
1.8-V I/O and 3.0-V (MMC1 Only),

Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

OMAP3 Devices:
- OMAP™ 3 Architecture
- MPU Subsystem
  - Up to 720-MHz ARM® Cortex™-A8 Core
  - NEON™ SIMD Coprocessor
- PowerVR® SGX™ Graphics Accelerator
  - Tile-Based Architecture Delivering up to 1 MPoly/sec
  - Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  - Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  - Fine-Grained Task Switching, Load Balancing, and Power Management
  - Programmable High-Quality Image Anti-Aliasing
- Fully Software-Compatible with ARM9™
- Commercial and Extended Temperature Grades
ARM Cortex-A8 Core
- ARMv7 Architecture
  - TrustZone®
  - Thumb®-2
  - MMU Enhancements
- In-Order, Dual-Issue, Superscalar Microprocessor Core
- NEON Multimedia Architecture
- Over 2x Performance of ARMv6 SIMD
- Supports Both Integer and Floating-Point SIMD
- Jazelle® RCT Execution Environment Architecture
- Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
- Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
ARM Cortex-A8 Memory Architecture:
- -KB Instruction Cache (4-Way Set-Associative)
- -KB Data Cache (4-Way Set-Associative)
- -KB L2 Cache
112KB of ROM
64KB of Shared SRAM
Endianess:
- ARM Instructions – Little Endian
- ARM Data – Configurable
External Memory Interfaces:
- General Purpose Memory Controller (GPMC)
  - 16-Bit-Wide Multiplexed Address and Data Bus
  - Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
  - Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
  - Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
  - Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
Camera Image Signal Processor (ISP)
- CCD and CMOS Imager Interface
- Memory Data Input
- BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
- Glueless Interface to Common Video Decoders
- Resize Engine
  - Resize Images From 1/4x to 4x
  - Separate Horizontal and Vertical Control
Display Subsystem
- Parallel Digital Output
  - Up to 24-Bit RGB
  - HD Maximum Resolution
  - Supports Up to 2 LCD Panels
  - Support for Remote Frame Buffer Interface (RFBI) LCD Panels
- 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
  - Composite NTSC and PAL Video
  - Luma and Chroma Separate Video (S-Video)
- Rotation 90-, 180-, and 270-Degrees
- Resize Images From 1/4x to 8x
- Color Space Converter
- 8-Bit Alpha Blending
Serial Communication
- 5 Multichannel Buffered Serial Ports (McBSPs)
  - 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
  - 5-KB Transmit and Receive Buffer (McBSP2)
  - SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
  - Direct Interface to I2S and PCM Device and TDM Buses
  - 128-Channel Transmit and Receive Mode
- Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
- High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
- High-, Full-, and Low-Speed Multiport USB Host Subsystem
  - 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
- One HDQ™/1-Wire® Interface
- UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
- Three Master and Slave High-Speed Inter-Integrated Circuit (I²C) Controllers
Removable Media Interfaces:
- Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
Comprehensive Power, Reset, and Clock Management
- SmartReflex™ Technology
- Dynamic Voltage and Frequency Scaling (DVFS)
Test Interfaces
- IEEE 1149.1 (JTAG) Boundary-Scan Compatible
- ETM Interface
- Serial Data Transport Interface (SDTI)
12 32-Bit General-Purpose Timers
2 32-Bit Watchdog Timers
1 32-Bit 32-kHz Sync Timer
Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
5-nm CMOS Technologies
Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
Discrete Memory Interface
Packages:
1.8-V I/O and 3.0-V (MMC1 Only),

Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

Streaming video
Video conferencing
High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

Linux®
Windows® CE
Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections:

Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
Section 4: Clock Specifications input and output clocks, DPLL and DLL
Section 5: Video Dac Specifications
Section 6: Timing Requirements and Switching Characteristics
Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

Streaming video
Video conferencing
High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

Linux®
Windows® CE
Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
Section 4: Clock Specifications input and output clocks, DPLL and DLL
Section 5: Video Dac Specifications
Section 6: Timing Requirements and Switching Characteristics
Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

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顶层文档	类型	标题	格式选项	日期
*	数据表	OMAP3515 and OMAP3503 Applications Processors 数据表 (Rev. H)		2013-10-10
*	勘误表	OMAP3530/25/15/03 Applications Processor Silicon Errata (Rev. F)		2010-10-12
	用户指南	SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V)		2020-6-1
	应用手册	(Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C)	PDF \| HTML	2020-3-3
	应用手册	OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles	PDF \| HTML	2019-3-20
	用户指南	How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS		2018-9-24
	应用手册	PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)		2013-11-1
	用户指南	OMAP35x Technical Reference Manual (Rev. Y)		2012-12-10
	用户指南	Delta for OMAP35x Technical Reference Manual Version X to Version Y (Rev. Y)		2012-12-10
	应用手册	PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II		2010-6-23
	应用手册	PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I		2010-6-23
	应用手册	Migrating from OMAP3530 to AM37x		2010-6-3
	应用手册	Migrating from OMAP3530 to AM35x		2010-5-24
	用户指南	OMAP35x Peripherals Overview Reference Guide (Rev. A)		2010-1-20
	应用手册	OMAP35x Linux PSP Data Sheet		2009-10-16
	设计指南	Powering OMAP35x with TPS65073x		2009-10-13
	应用手册	Powering OMAP™3 With TPS6235x: Design-In Guide		2008-12-3
	应用手册	OMAP35x 0.65mm Pitch Layout Methods (Rev. B)		2008-6-26

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